STK581U3C2DGEVB
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6
BILL OF MATERIALS
Table 2. EVALUATION BOARD BILL OF MATERIALS
Compon-
ents
Symbol SMD DIP Manufacturer Part Number Specification Supplement
Resistor
R1 1 KOA RK73H1JTTD2002F
20 kW/ 0.1 W /
±1%
Chip (1608 size) Fault pull−up
R2 − R7 6 KOA RK73H1JTTD1000F
100 W / 0.1 W /
±1%
Chip (1608 size) Signal input low
pass filter
R8 − R13 6 KOA RK73H1JTTD3301F
3.3 kW / 0.1 W /
±1%
Chip (1608 size) Signal input
pull−down
Capacitor
C1, C2 2 Nippon Chemi−Con EKMM451VSN471MA50S
470 mF / 450 V /
±20%
Aluminum
electrolytic
capacitor
Plus−Minus
C3 1 PANASONIC ECQE6225JT
2.2 mF / 630 V /
±5%
Film capacitor Plus−Minus,
Snubber
C4−C6 3 Nippon Chemi−Con EKMG350ELL470ME11D
47 mF / 35 V /
±20%
Aluminum
electrolytic
capacitor
VBx − VSx
C7 1 Nippon Chemi−Con EKMG350ELL221MHB5D
220 mF / 35 V /
±20%
Aluminum
electrolytic
capacitor
VDD−VSS
C8 − C11 4 MURATA GRM188B31H104K
0.1 mF / 50 V /
±10%
Chip (1608 size) VBx − Vsx,
VDD−VSS
C12 − C17 6 MURATA GRM1882C1H101J 100 pF / 50 V /
±5%
Chip (1608 size) Signal input low
pass filter
Connector CN1 1 HIROSE
ELECTRIC
A2−14PA−2.54DSA(71) 14 pin /
2.54 pitch
Pin (S) VSS, VDD,
VEXT, ISO,
FAULT,
HIN1−3,
LIN1−3,
V+, V−
13 Mac8 ST−1−3
Pin (L) U, V, W, +,
−
5 Faston terminal
(Tab)
IC IC1 1 ON Semiconductor STK581U3C2D−E SIP3 / 1shunt
Total 23 27