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LBB120H

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R08
LBB120
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=170mA
DC
)
Temperature (ºC)
Turn-On Time (ms)
-40
0.12
0.10
0.08
0.06
0.04
0.02
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Operation
vs. Temperature
(I
F
=5mA, I
L
=170mA
DC
)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical On-Resistance vs. Temperature
(I
F
=5mA, I
L
=170mA
DC
)
Temperature (ºC)
On-Resistance (:)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Typical Turn-Off Time
vs. Temperature
(I
L
=170mA
DC
)
Temperature (ºC)
Turn-Off Time (ms)
-40
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
I
F
=5mA
I
F
=10mA
I
F
=20mA
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=170mA
DC
)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Load Current vs. Load Voltage
(I
F
=5mA)
Load Voltage (V)
Load Current (mA)
200
150
100
50
0
-50
-100
-150
-200
-2.0 -1.5 -1.0 -0.5 0.5 1.0 1.5
0
2.0
Maximum Load Current vs. Temperature
(I
F
=5mA)
Temperature (ºC)
Load Current (mA)
250
200
150
100
50
0
-40 -20 0 20 40 60 80 120100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (V
P
)
-40
310
305
300
295
290
285
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
Temperature (ºC)
Leakage (PA)
-40
0.030
0.025
0.020
0.015
0.010
0.005
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
1.2
1.0
0.8
0.6
0.4
0.2
0
10Ps 1ms 100ms 10s100Ps 10ms 1s 100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
I
NTEGRATED
C
IRCUITS
D
IVISION
LBB120
www.ixysic.com
5
R08
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LBB120 / LBB120S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LBB120 / LBB120S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R08
LBB120
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
LBB120
LBB120S
P1-P3P4-P6P7-P7

LBB120H

Mfr. #:
Buy LBB120H
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount 250V 170mA Dual Sing OptoMOS Relay
Lifecycle:
New from this manufacturer.
Delivery:
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