CZRL5232B-G

Document Number: 91241 www.vishay.com
S11-0443-Rev. B, 14-Mar-11 1
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Power MOSFET
IRFPC50A, SiHFPC50A
Vishay Siliconix
FEATURES
• Low Gate Charge Q
g
Results in Simple Drive
Requirement
Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
• Fully Characterized Capacitance and Avalanche Voltage
and Current
Effective C
oss
Specified
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Switch Mode Power Supply (SMPS)
Uninterruptable Power Supply
High Speed Power Switching
TYPICAL SMPS TOPOLOGY
PFC Boost
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting T
J
= 25 °C, L = 15 mH, R
g
= 25 , I
AS
= 11 A (see fig. 12).
c. I
SD
11 A, dI/dt 126 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
PRODUCT SUMMARY
V
DS
(V) 600
R
DS(on)
()V
GS
= 10 V 0.58
Q
g
(Max.) (nC) 70
Q
gs
(nC) 19
Q
gd
(nC) 28
Configuration Single
N-Channel MOSFET
G
D
S
TO-247AC
G
D
S
Available
RoHS*
COMPLIANT
ORDERING INFORMATION
Package TO-247AC
Lead (Pb)-free
IRFPC50APbF
SiHFPC50A-E3
SnPb
IRFPC50A
SiHFPC50A
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
600
V
Gate-Source Voltage V
GS
± 30
Continuous Drain Current V
GS
at 10 V
T
C
= 25 °C
I
D
11
AT
C
= 100 °C 7.0
Pulsed Drain Current
a
I
DM
44
Linear Derating Factor 1.4 W/°C
Single Pulse Avalanche Energy
b
E
AS
920 mJ
Repetitive Avalanche Current
a
I
AR
11 A
Repetitive Avalanche Energy
a
E
AR
18 mJ
Maximum Power Dissipation T
C
= 25 °C P
D
180 W
Peak Diode Recovery dV/dt
c
dV/dt 4.9 V/ns
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to + 150
°C
Soldering Recommendations (Peak Temperature) for 10 s 300
d
Mounting Torque 6-32 or M3 screw
10 lbf · in
1.1 N · m
* Pb containing terminations are not RoHS compliant, exemptions may apply
www.vishay.com Document Number: 91241
2 S11-0443-Rev. B, 14-Mar-11
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRFPC50A, SiHFPC50A
Vishay Siliconix
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 μs; duty cycle 2 %.
c. C
oss
eff. is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 % to 80 % V
DS
.
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
thJA
-40
°C/W
Case-to-Sink, Flat, Greased Surface
R
thCS
0.24 -
Maximum Junction-to-Case (Drain)
R
thJC
-0.65
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 600 - - V
V
DS
Temperature Coefficient
V
DS
/T
J
Reference to 25 °C, I
D
= 1 mA
-0.65-
V/°C
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2.0 - 4.0 V
Gate-Source Leakage I
GSS
V
GS
= ± 30 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 600 V, V
GS
= 0 V - - 25
μA
V
DS
= 480 V, V
GS
= 0 V, T
J
= 125 °C - - 250
Drain-Source On-State Resistance R
DS(on)
V
GS
= 10 V I
D
= 6.0 A
b
- - 0.58
Forward Transconductance g
fs
V
DS
= 50 V, I
D
= 6.0 A
b
7.7 - - S
Dynamic
Input Capacitance C
iss
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
-2100-
pF
Output Capacitance C
oss
-270-
Reverse Transfer Capacitance C
rss
-9.7-
Output Capacitance C
oss
V
GS
= 0 V
V
DS
= 1.0 V, f = 1.0 MHz - 2830 -
V
DS
= 480 V, f = 1.0 MHz - 74 -
Effective Output Capacitance C
oss
eff. V
DS
= 0 V to 480 V
c
-81-
Total Gate Charge Q
g
V
GS
= 10 V
I
D
= 11 A, V
DS
= 480 V
see fig. 6 and 13
b
--70
nC Gate-Source Charge Q
gs
--19
Gate-Drain Charge Q
gd
--28
Turn-On Delay Time t
d(on)
V
DD
= 300 V, I
D
= 11 A
R
g
= 6.2 , R
D
= 30
see fig. 10
b
-15-
ns
Rise Time t
r
-40-
Turn-Off Delay Time t
d(off)
-33-
Fall Time t
f
-29-
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
MOSFET symbol
showing the
integral reverse
p - n junction diode
--11
A
Pulsed Diode Forward Current
a
I
SM
--44
Body Diode Voltage V
SD
T
J
= 25 °C, I
S
= 11 A, V
GS
= 0 V
b
--1.4V
Body Diode Reverse Recovery Time t
rr
T
J
= 25 °C, I
F
= 11 A,
dI/dt = 100 A/μs
b
- 500 740 ns
Body Diode Reverse Recovery Charge Q
rr
-4.06.0μC
Forward Turn-On Time t
on
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
S
D
G
Document Number: 91241 www.vishay.com
S11-0443-Rev. B, 14-Mar-11 3
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRFPC50A, SiHFPC50A
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Fig. 1 - Typical Output Characteristics
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
0.1
1
10
100
0.1 1 10 100
20μs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
1
10
100
1 10 100
20μs PULSE WIDTH
T = 150 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
1
10
100
4.0 5.0 6.0 7.0 8.0 9.0
V = 50V
20μs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 150 C
J
°
100V
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
3.0
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
13A

CZRL5232B-G

Mfr. #:
Manufacturer:
Comchip Technology
Description:
Zener Diodes VZ=5.6V
Lifecycle:
New from this manufacturer.
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