MAX2205–MAX2208
RF Power Detectors in UCSP
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Note 1: This device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020 rev. C or later, paragraph 7.6, Table 3 for IR/VPR and convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Note 2: Specifications over T
A
= -40°C to +85°C are guaranteed by design. Production tests are performed at T
A
= +25°C.
Note 3: Response time is taken from the time the RF signal is applied to 90% of the final value of V
OUT
.
Note 4: At 800MHz, output voltage is held at a value that nominally results from the final value of +31dBm input power. Deviation from
+31dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +28dBm input power. Deviation
from +28dBm is specified.
Note 5: At 2GHz, output voltage is held 22dB lower than specified in Note 4. At 800MHz, output voltage is held 25dB lower than spec-
ified in Note 4.
Note 6: At 800MHz, output voltage is held at a value that nominally results from +15dBm input power. Deviation from +15dBm is
specified. At 2GHz, output voltage is held at a value that nominally results from +13dBm input power. Deviation from +13dBm
is specified.
Note 7: For MAX2206, the output voltage is held at 40dB lower input power than specified in Note 6; for MAX2207/MAX2208, output
voltage is held at a value that nominally results from 25dB lower input power than specified in Note 6. Deviation from the
nominal input power is specified.
AC ELECTRICAL CHARACTERISTICS (MAX2206/MAX2207/MAX2208)
(MAX2206/MAX2207/MAX2208 EV kit, V
CC
= +2.7V to +5.0V, SHDN = 2.0V, f
RF
= 800MHz to 2GHz, 50Ω system, T
A
= -40°C to
+85°C. Typical values are at V
CC
= +2.85V and T
A
= +25°C, unless otherwise noted.) (Note 2)