18V, High Efficiency, DC-DC Step-Up Converter AS1345 – 5
Stresses beyond those listed in the table below may cause
permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other
conditions beyond those indicated in “Electrical
Characteristics” on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure AS1345 – 6:
Absolute Maximum Ratings
Note: The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC
J-STD-020“Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”.
Parameter Min Max Unit Comments
Electrical Parameters
VDD, SWIN, SWOUT to GND -0.3 7 V
LX, FB to GND -0.3 20 V
Input Current (latch-up
immunity)
-100 100 mA Norm: JEDEC 78
SWIN to SWOUT Current Limit 1 A
Electrostatic Discharge
Electrostatic Discharge HBM ±2 kV Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Junction temperature +110 ºC
Storage temperature range
-55 +125 ºC for WL-CSP
-55 +150 ºC for TDFN
Package thermal
data
WL-CSP 60
ºC/W
Junction-to-ambient thermal resistance is very
dependent on application and board-layout. In
situations where high maximum power
dissipation exists, special attention must be
paid to thermal dissipation during board
design.
TDFN 97
Package body
temperature
WL-CSP
+260 ºC
Norm IPC/JEDEC J-STD-020
TDFN Norm IPC/JEDEC J-STD-020
Humidity non-condensing 5 85 %
Moisture sensitive level
3
Represents a maximum floor life time of 168h
for TDFN
1
Represents a maximum floor life time of
unlimited for WL-CSP
