BUK754R0-40C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 20 July 2010 3 of 14
NXP Semiconductors
BUK754R0-40C
N-channel TrenchMOS standard level FET
4. Limiting values
[1] -20V accumulated duration not to exceed 168 hrs
[2] Current is limited by power dissipation chip rating.
[3] Continuous current is limited by package.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage T
j
25 °C; T
j
175 °C - 40 V
V
DGR
drain-gate voltage R
GS
=20k -40V
V
GS
gate-source voltage
[1]
-20 20 V
I
D
drain current T
mb
=2C; V
GS
= 10 V; see Figure 1;
see Figure 3
[2]
- 159 A
T
mb
=10C; V
GS
=10V; see Figure 1
[3]
- 100 A
T
mb
=2C; V
GS
= 10 V; see Figure 1;
see Figure 3
[3]
- 100 A
I
DM
peak drain current T
mb
=2C; t
p
10 µs; pulsed;
see Figure 3
- 636 A
P
tot
total power dissipation T
mb
= 25 °C; see Figure 2 - 203 W
T
stg
storage temperature -55 175 °C
T
j
junction temperature -55 175 °C
Source-drain diode
I
S
source current T
mb
=2C
[3]
- 100 A
[2]
- 159 A
I
SM
peak source current t
p
10 µs; pulsed; T
mb
= 25 °C - 636 A
Avalanche ruggedness
E
DS(AL)S
non-repetitive drain-source
avalanche energy
I
D
=100A; V
sup
40 V; R
GS
=50;
V
GS
=10V; T
j(init)
= 25 °C; unclamped
- 292 mJ
BUK754R0-40C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 20 July 2010 4 of 14
NXP Semiconductors
BUK754R0-40C
N-channel TrenchMOS standard level FET
Fig 1. Normalized continuous drain current as a
function of mounting base temperature.
Fig 2. Normalized total power dissipation as a
function of mounting base temperature
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
003aac893
0
50
100
150
200
25 75 125 175
T
mb
(
°
C)
I
D
(A)
Capped at 100A due to package
T
mb
(°C)
0 20015050 100
03na19
40
80
120
P
der
(%)
0
003aac581
10
-1
1
10
10
2
10
3
10
-1
1 10 10
2
V
DS
(V)
I
D
(A)
DC
Limit R
DSon
= V
DS
/ I
D
100 ms
10 ms
1 ms
100
μ
s
t
p
= 10
μ
s
BUK754R0-40C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 20 July 2010 5 of 14
NXP Semiconductors
BUK754R0-40C
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from
junction to mounting base
see Figure 4 --0.74K/W
R
th(j-a)
thermal resistance from
junction to ambient
vertical in still air - - 60 K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
003aac590
10
-3
10
-2
10
-1
1
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
t
p
(s)
Z
th (j-mb)
(K/W)
δ
= 0.5
0.2
0.1
0.02
single pulse
0.05
t
p
T
P
t
t
p
T
δ =

BUK754R0-40C,127

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET N-CH 40V 100A TO220AB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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