DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM
16 of 18
POWER-UP/DOWN CHARACTERISTICS—3.3V
(V
CC
= 3.3V 10%, Over the Operating Range.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CE or WE at V
IH
, Before
Power-Down
t
PD
0
s
V
CC
Fall Time: V
PF(MAX)
to V
PF(MIN)
t
F
300
s
V
CC
Rise Time: V
PF(MIN)
to V
PF(MAX)
t
R
0
s
V
PF
to RST High
t
REC
40 200 ms
Expected Data-Retention Time
(Oscillator On)
t
DR
(Notes 6, 7) 10 years
Figure 9. Power-Up/Down Waveform Timing (3.3V Device)
CAPACITANCE
(T
A
= +25°C)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Capacitance on All Input Pins C
IN
(Note 1) 14 pF
Capacitance on IRQ/FT, RST,
and DQ Pins
C
IO
(Note 1) 10 pF
DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM
17 of 18
AC TEST CONDITIONS
Output Load: 50 pF + 1TTL Gate
Input Pulse Levels: 0.0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1. Voltage referenced to ground.
2. Typical values are at +25C and nominal supplies.
3. Outputs are open.
4. Battery switchover occurs at the lower of either the battery voltage or V
PF
.
5. The IRQ/FT and RST outputs are open drain.
6. Data-retention time is at +25C.
7. Each DS1556 has a built-in switch that disconnects the lithium source until V
CC
is first applied by the
user. The expected t
DR
is defined for DIP modules and PowerCap modules as a cumulative time in the
absence of V
CC
starting from the time power is first applied by the user.
8. RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques
as long as temperature exposure to the lithium energy source contained within does not exceed
+85C. Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic
vibration is not used.
In addition, for the PowerCap:
a. Maxim recommends that PowerCap Module bases experience one pass through solder reflow
oriented with the label side up (“live-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to
remove solder.
9. t
AH1
, t
DH1
are measured from WE going high.
10. t
AH2
, t
DH2
are measured from CE going high.
11. t
WC
= 200ns.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-”
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO.
32 EDIP MDF32+1
21-0245
34 PWRCP PC2+6
21-0246
DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM
18 of 18
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses
are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
2010 Maxim Integrated Products Maxim and the Dallas logo are registered trademarks of Maxim Integrated Products.
REVISION HISTORY
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
9/10
Updated the Ordering Information table to include only lead-free parts; updated the Absolute
Maximum Ratings section to include the storage temperature range and lead and soldering
temperatures for EDIP and PowerCap packages; added Note 11 to the I
CC
parameter in the DC
Electrical Characteristics tables (for 5.0V and 3.3V) and the Notes section; replaced the
package outline drawings with the Package Information table
2, 11, 12, 17

DS1556WP-120IND+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Real Time Clock 1M NV RAM Timekeeper
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union