Page 6 ams Datasheet
Document Feedback [v2-23] 2016-Mar-30
AS3685A/AS3685B − Absolute Maximum Ratings
Stresses beyond those listed in Absolute Maximum Ratings may
cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any
other conditions beyond those indicated in
Electrical Characteristics is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 7:
Absolute Maximum Ratings
Note(s):
1. Depending on actual PCB layout and PCB used; for peak power dissipation during flashing see document ‘AS3685 Thermal
Measurements’.
For 1A flash current see application notes ‘AN3685_1Aflash’ and ‘AN3685_1Aflash_thermal_1v0’.
2. The PT derating factor changes the total continuous power dissipation, if the ambient temperature is different to 70°C. Therefore
for e.g. 85°C calculate PT
85
°C
= PT – P
DERATE
* (85°C to 70°C).
Symbol Parameter Min Max Units Comments
V
BATMAX
Maximum Supply Voltage -0.3 7.0 V
I
IN
Input Pin Current without
causing latchup
-25 +25 mA At 25°C, according to JEDEC 17
T
STRG
Storage Temperature Range -55 125 °C
RH
NC
Relative Humidity
(non-condensing)
5 85 %
ESD
HBM
Electrostatic Discharge
(Human Body Model)
±1000 V MIL 883 E Method 3015
PT
Total Continuous Power
Dissipation
1.14 W
DFN10 (3x3mm), T
AMB
= 70°C
(1)
1.02 W
WL-CSP (2x1.5mm),
T
AMB
= 70°C
(1)
P
DERATE
PT Derating Factor
(2)
16.3 mW/ °C DFN10 (3x3mm)
14.7 mW/ °C WL-CSP (2x1.5mm)
T
JUNC
Junction Temperature 150 °C
T
BODY
Body Temperature during
Soldering
260 °C
According to IPC/JEDEC
J-STD-020C
MSL Moisture sensitivity level
1
WLCSP package;
Represents a max. floor life time of
unlimited hours
3
DFN package;
Represents a max. floor life time of
168 hours
