SP723AB

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5
TVS DIODE ARRAYS
TVS Diode Arrays
SP723
Electronic Protection Array for ESD and Overvoltage Protection
Peak Transient Current Capability of the SP723
The peak transient current capability rises sharply as the width of the
current pulse narrows. Destructive testing was done to fully evaluate the
SP723’s ability to withstand a wide range of peak current pulses vs time.
The circuit used to generate current pulses is shown in Figure 5.
The test circuit of Figure 5 is shown with a positive pulse input. For a
negative pulse input, the (-) current pulse input goes to an SP723 ‘IN’
input pin and the (+) current pulse input goes to the SP723 V- pin. The
V+ to V- supply of the SP723 must be allowed to float. (i.e., It is not tied
to the ground reference of the current pulse generator.) Figure 6 shows
the point of overstress as defined by increased leakage in excess of the
data sheet published limits.
The maximum peak input current capability is dependent on the ambient
temperature, improving as the temperature is reduced. Peak current
curves are shown for ambient temperatures of 25
o
C and 105
o
C and a 15V
power supply condition.The safe operating range of the transient peak
current should be limited to no more than 75% of the measured over-
stress level for any given pulse width as shown in the curves of Figure 6.
Note that adjacent input pins of the SP723 may be paralleled to improve
current (and ESD) capability. The sustained peak current capability is
increased to nearly twice that of a single pin.
+
-
CURRENT
SENSE
VO LTAGE
PROBE
6
7
8
5
1
2
3
4
IN
IN
IN
V-
V+
IN
IN
IN
+
-
R
1
~ 10 TYPICAL
SP723
V
X
V
X
ADJ. 10V/A TYPICAL
R
1
(-)
(+)
C1 ~ 100µF
C1
VARIABLE TIME DURATION
CURRENT PULSE GENERATOR
FIGURE 5. TYPICAL SP723 PEAK CURRENT TEST CIRCUIT
WITH A VARIABLE PULSE WIDTH INPUT
FIGURE 6. SP723 TYPICAL SINGLE PULSE PEAK CURRENT CURVES SHOWING THE MEASURED POINT OF OVERSTRESS IN
AMPERES vs PULSE WIDTH TIME IN MILLISECONDS
0.001 0.01 0.1 1
PULSE WIDTH TIME (ms)
PEAK CURRENT (A)
10
14
12
10
8
6
4
2
0
100 1000
CAUTION:
OF THE VALUES SHOWN ON EACH CURVE.
PULSE WIDTH TO BE NO GREATER THAN 75%
THE MAXIMUM PEAK CURRENT FOR A GIVEN
V+ TO V- SUPPLY = 15V
T
A
= 105
o
C
T
A
= 25
o
C
SAFE OPERATING CONDITIONS LIMIT
244
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TVS Diode Arrays
Electronic Protection Array for ESD and Overvoltage Protection
SP723
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
C
L
E
e
A
C
e
B
e
C
-B-
E1
INDEX
1 2 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A
1
-A-
0.010 (0.25) C AM BS
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and are measured with the leads constrained to be per-
pendicular to datum .
7. e
B
and e
C
are measured at the lead tips with the leads uncon-
strained. e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
e
A
-C-
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8, 10
C 0.008 0.014 0.204 0.355 -
D 0.355 0.400 9.01 10.16 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
e
A
0.300 BSC 7.62 BSC 6
e
B
- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N8 89
245
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5
TVS Diode Arrays
SP723
Electronic Protection Array for ESD and Overvoltage Protection
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AM BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
µ
0.25(0.010) BM M
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “Lis the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.1890 0.1968 4.80 5.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N8 87
0
o
8
o
0
o
8
o
-
µ
TVS DIODE ARRAYS

SP723AB

Mfr. #:
Manufacturer:
Littelfuse
Description:
ESD Suppressors / TVS Diodes SP723AB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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