SSM6N39TU,LF

SSM6N39TU
2014-03-01
1
TOSHIBA Field-Effect Transistor Silicon N Channel MOS Type
SSM6N39TU
Power Management Switch Applications
High-Speed Switching Applications
1.5-V drive
N-ch 2-in-1
Low ON-resistance: R
on
= 247m (max) (@V
GS
= 1.5 V)
R
on
= 190m (max) (@V
GS
= 1.8 V)
R
on
= 139m (max) (@V
GS
= 2.5 V)
R
on
= 119m (max) (@V
GS
= 4.0 V)
Absolute Maximum Ratings (Ta = 25 °C) (Q1,Q2 Common)
Characteristic Symbol Rating Unit
Drain-source voltage V
DSS
20 V
Gate-source voltage V
GSS
± 10 V
DC I
D
1.6
Drain current
Pulse I
DP
3.2
A
Drain power dissipation P
D
(Note1) 500 mW
Channel temperature T
ch
150 °C
Storage temperature range T
stg
55 to 150 °C
Note: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions
(i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated
failure rate, etc).
Note1: Mounted on an FR4 board. (total dissipation)
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad : 645 mm
2
)
Unit: mm
0.3-0.05
6
1.7±0.1
2.1±0.1
1.3±0.1
1
2
0.650.65
3
2.0±0.1
5
4
0.7±0.05
+0.1
0.166±0.05
JEDEC
JEITA
TOSHIBA 2-2T1B
Weight: 7.0mg (typ.)
1.Source1
2.Gate1
3.Drain2
4.Source2
5.Gate2
6.Drain1
UF6
Start of commercial production
2008-01
SSM6N39TU
2014-03-01
2
Electrical Characteristics (Ta = 25°C) (Q1,Q2 Common)
Characteristics Symbol Test Conditions Min Typ. Max Unit
V
(BR) DSS
I
D
= 1 mA, V
GS
= 0 V 20
Drain-source breakdown voltage
V
(BR) DSX
I
D
= 1 mA, V
GS
= -10 V 12
V
Drain cutoff current I
DSS
V
DS
=20 V, V
GS
= 0 V 1 μA
Gate leakage current I
GSS
V
GS
= ±10 V, V
DS
= 0 V ±1 μA
Gate threshold voltage V
th
V
DS
= 3 V, I
D
= 1 mA 0.35 1.0 V
Forward transfer admittance |Y
fs
| V
DS
= 3 V, I
D
= 1A (Note 2) 2.5 5.0 S
I
D
= 1 A, V
GS
= 4.0 V (Note 2) 87 119
I
D
= 1 A, V
GS
= 2.5 V (Note 2) 105 139
I
D
= 0.8 A, V
GS
= 1.8 V (Note 2) 125 190
Drain-source ON-resistance R
DS (ON)
I
D
= 0.3 A, V
GS
= 1.5 V (Note 2) 145 247
mΩ
Input capacitance C
iss
260
Output capacitance C
oss
45
Reverse transfer capacitance C
rss
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
37
pF
Total Gate Charge Q
g
7.5
Gate-Source Charge Q
gs
5.6
Gate-Drain Charge Q
gd
V
DS
= 10 V, I
D
= 1.6 A, V
GS
= 4 V
1.9
nC
Turn-on time t
on
8.3
Switching time
Turn-off time t
off
V
DD
= 10 V, I
D
= 0.5 A
V
GS
= 0 to 2.5 V, R
G
= 4.7 Ω
11.5
ns
Drain-source forward voltage V
DSF
I
D
= -1.6 A, V
GS
= 0 V (Note 2)
-0.8 -1.2 V
Note 2: Pulse test
SSM6N39TU
2014-03-01
3
Switching Time Test Circuit
(a) Test Circuit (b) V
IN
Marking Equivalent Circuit
(top view)
Usage Considerations
Let V
th
be the voltage applied between gate and source that causes the drain current (I
D
)
to below (1 mA for the
SSM6N39TU). Then, for normal switching operation, V
GS(on)
must be higher than V
th,
and V
GS(off)
must be lower than
V
th.
This relationship can be expressed as: V
GS(off)
< V
th
< V
GS(on).
Take this into consideration when using the device.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
6
N
N1
4
1 2 3
5 4
12 3
65
Q2
Q1
(c) V
OUT
V
DD
= 10 V
R
G
= 4.7 Ω
Duty 1%
V
IN
: t
r
, t
f
< 5 ns
Common Source
Ta = 25°C
V
DD
OUT
IN
2.5 V
0
10 μs
R
G
t
f
t
on
90%
10%
2.5 V
0 V
10%
90%
t
off
t
r
V
DD
V
DS
(
ON
)

SSM6N39TU,LF

Mfr. #:
Manufacturer:
Toshiba
Description:
MOSFET LowON Res MOSFET ID=1.6A VDSS=20V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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