53-0000-0200

988 Soldering Flux
Low-Solids No-Clean Liquid Flux
Product Description
Kester 988 ux is a low solids, no-clean ux that is specially designed for excellent solderability and best-in-class through-
hole ll in lead-free wave soldering process. The residue left behind is evenly distributed and non-tacky so that boards are
cosmetically clean as they exit the wave solder machine. The residue remaining after soldering is non-conductive and can
be left on the boards without degrading the reliability of the assembly. 988 is classied as Type ROM0 ux under J-STD-
004A specications.
Physical Properties
Specic Gravity: 0.808
Anton Paar DMA 35 @ 25°C
Percent Solids (theoretical): 6.0
Acid Number (typical): 30.0 mg
KOH/g of ux
Tested by potentiometric titration
Thinner: 4662
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2015/863 for the
stated banned substances.
Performance Characteristics:
Best-in-class through hole-ll
Provides excellent solderability on
surface mount circuit boards for
defect-free soldering even after 2x
SMT reow cycles
Evenly distributed, uniform and
tack-free residues on solder mask
No surface insulation degradation
Suitable for leaded and lead-free
(SnCu and SnAgCu) alloys
Eliminates the needs and expense
of cleaning
Classied as ROM0 per J-STD-004
Reliability Properties
Copper Mirror Corrosion: Moderate
Tested to J-STD-004A, IPC-TM-650, Method 2.3.32
Corrosion Test: Moderate
Tested to J-STD-004A, IPC-TM-650, Method 2.6.15
Silver Chromate: Pass
Tested to J-STD-004A, IPC-TM-650, Method 2.3.33
Chloride and Bromides: None Detected
Tested to J-STD-004A, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004A, IPC-TM-650, Method 2.3.35.1
Surface Insulation Resistivity (SIR), (typical): Pass
Tested to J-STD-004A, IPC-TM-650, Method 2.6.3.3
Blank 988 PD 988 PU
Day 1 8.4*10
10
1.1*10
10
9.9*10
9
Day 4 7.6*10
10
1.3*10
10
2.6*10
10
Day 7 5.8*10
10
1.5*10
10
2.7*10
10
Electromigration, Bellcore (typical): Pass
Tested to Bellcore GR-78-CORE
Blank 988 PD 988PU
Day 4 1.1*10
11
6.6*10
8
2.4*10
9
Day 21 1.9*10
11
1.3*10
10
7.0*10
10
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808
Website: www.kester.com
®
Technical Data Sheet
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
and warning label before using this product.
Storage, Handling and Shelf Life
988 is ammable. Store away from sources of ignition. Shelf life is 1 year from date of manufacture when handled proper-
ly and held at 10-25°C (50-77°F).
Cleaning
988 ux residues are non-conductive, non-corrosive and do not require removal in most applications. If residue removal is
required, Kester 5252 Cleaner may be used.
Flux Application
988 can be applied via foam or spray uxing. Flux deposition should be 155-310 μg of solids/cm
2
(600-1200 μg of solids/
in
2
). An air knife after the ux tank is recommended to remove excess ux from the circuit board and prevent dipping on
the preheated surface. For foam, uxing, the consistency should be maintaining only using Kester 4662 Thinner to com-
pensate for evaporation loss.
Process Considerations
The optimum preheat temperature for most circuit assemblies is 95-105°C (203-221°F) as measured on the top or
component side of the printed circuit board. The bottom of the board will not reach 145°C (293°F). Dwell time in the solder
is typically 2-4 seconds for leaded alloys and 4-8 seconds for lead-free alloys. The conveyor speed should be adjusted to
accomplish proper board contact time with the solder. Then the preheat temperatures are adjusted to achieve the required
preheat top board temperatures. In the event you need further direction on the setup of your wave soldering system,
please contact Kester Technical Support.
Flux Control
Kester PS-20 Test Kit # 53-0000-0200 is available to insure the level of solids in the ux. The instructions of how to use
this kit will come with the purchase of the kit. This could be used as an incoming inspection device or if a container had
been left open for any period of time allowing the solvents to evaporate. The ux thinner is Kester’s 4662.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808
Website: www.kester.com
®
Application Notes

53-0000-0200

Mfr. #:
Manufacturer:
Kester
Description:
PS-20 TITRATION KIT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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