9
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter Symbol Min. Max. Units
Storage Temperature T
S
-55 125 °C
Operating Temperature** T
A
-40 85 °C
Average Forward Input Current I
F(AVG)
20 mA
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
I
FPK
40 mA
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
I
F(TRAN)
1.0 A
Reverse Input Voltage V
R
5 V
HCNW139/138 3 V
Input Power Dissipation P
I
35 mW
Output Current (Pin 6) I
O
60 mA
Emitter Base Reverse Voltage (Pin 5-7) V
EB
0.5 V
Supply Voltage and Output Voltage
(6N139, HCPL-0701, HCNW139)
V
CC
-0.5 18 V
Supply Voltage and Output Voltage
(6N138, HCPL-0700, HCNW138)
V
CC
-0.5 7 V
Output Power Dissipation P
O
100 mW
Total Power Dissipation P
T
135 mW
Lead Solder Temperature
(for Through Hole Devices)
260°C for 10 sec., 1.6 mm below seating plane
HCNW139/138 260°C for 10 sec., up to seating plane
Reow Temperature Prole
(for SOIC-8 and Option #300)
See Package Outline Drawings section
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage V
CC
4.5 18 V
Forward Input Current (ON) I
F(ON)
0.5 12.0 mA
Forward Input Voltage (OFF) V
F(OFF)
0 0.8 V
Operating Temperature T
A
0 70 °C
