BGA8U1BN6E6327XTSA1

Data Sheet 7 Revision 3.1
2017-09-14
BGA8U1BN6
Low Noise Amplifier for Ultra High Band 4-6GHz (f.e. LTE - U/ LAA with bypass)
Application Information
4 Application Information
Application Board Configuration
Figure 2 Application Schematic BGA8U1BN6
Note: No external DC blocking capacitor at RFin is required in typical applications as long as no DC is applied.
A list of all application notes is available at http://www.infineon.com/ltelna
Table 5 Bill of Materials
Name Value Package Manufacturer Function
C1 (optional) 1nF 0402 Various Input matching
C2 (optional) 1nF 0402 Various RF bypass
1)
1) RF bypass recommended to mitigate power supply noise
N1 BGA8U1BN6 TSNP-6-2 Infineon SiGe LNA
BGA8U1BN6_Schematic.vsd
N1 BGA8U1BN6
GND, 5
AI, 6
GPIO1, 4
GPIO2, 1
AO, 3
VCC, 2
C1
(optional)
RFin
VCC
RFout
GPIO2
GPIO1
GND
C2
Data Sheet 8 Revision 3.1
2017-09-14
BGA8U1BN6
Low Noise Amplifier for Ultra High Band 4-6GHz (f.e. LTE - U/ LAA with bypass)
Package Information
5 Package Information
Figure 3 TSNP-6-2 Package Outline (top, side and bottom views)
Figure 4 Footprint Recommendation TSNP-6-2
Figure 5 Marking Layout (top view)
0.02 MAX.
±0.05
0.7
±0.05
0.2
1)
±0.05
0.2
1)
1.1
±0.05
0.4
6x
0.1 B
0.1
6x
A
A
B
1) Dimension applies to plated terminals
52
6
4
1
3
Top view Bottom view
Pin 1 marking
TSNP-6-2-PO V01
+0.025
0.375
-0.015
STANDOFF
2 x 0.4 = 0.8
0.25
0.4
0.25
0.4
0.25
0.4
0.25
0.4
TSNP-6-2-FP V01
Stencil apertures
Copper Solder mask
(stencil thickness 100 µm)
NSMD
Data Sheet 9 Revision 3.1
2017-09-14
BGA8U1BN6
Low Noise Amplifier for Ultra High Band 4-6GHz (f.e. LTE - U/ LAA with bypass)
Package Information
Figure 6 Tape & Reel Dimensions (reel diameter 180 mm, pieces/reel 15000)
2
0.5
Pin 1
marking
TSNP-6-2-TP V01
0.85
1.25
8

BGA8U1BN6E6327XTSA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
RF Amplifier RF SILICON MMIC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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