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TM
Innovative Technology
for a Connected World
Tputty
TM
504 Series
SOFT, SILICONE GEL
Tputty™ 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances
are present.
The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance.
Tputty™ 504 is soft and compliant transferring little to no pressure between interfaces. Because Tputty™
504 has a higher viscosity than grease, it eliminates the bleed and pump-out usually associated with
grease. Bond line variances can also be more easily controlled than with traditional thermal pads.
Tputty™ 504 can be applied like grease and is easily dispensable from a wide range of commercially
available equipment including screen print, syringe and automated equipment.
FEATURES AND BENEFITS
• Soft and compliant transferring little to no
pressure between interfaces
• 1.8 W/mK thermal conductivity
• Available in 10cc, 30cc and 55cc syringes
• Available in 100cc,170cc and 305cc
auto dispense cartridges
• Available in bulk containers from
sample jars through 20 kg pails
• Applies like grease and is easily dispensable
from a wide range of commercially available
equipment including screen print, syringe
and automated equipment
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
APPLICATIONS
• Flip chip microprocessors
• PPGAs, micro BGAs, BGAs
• DSP chips, graphic accelerator chips
• Other high-wattage electronic components
• LED lighting
