BLM15HD182SN1D

Reference Spec.No.JENF243A-0024K-01 P1/9
MURATA MFG.CO.,LTD.
Reference Only
GHz Noise Suppression Chip Ferrite Bead
BLM15H□□□□SN1 Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15H_SN series.
2.Part Numbering
(ex.) BL M 15 HG 601 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (2)Type (3)Dimension() (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance (Ω)
(Under Standard
Testing Condition)
Rated
Current
(mA)
DC Resistance
(Ω max.)
Remark
Initial
Values
Values
After
Testing
at 100MHz at 1GHz
BLM15HG601SN1D
600±25% 1000±40% 300
0.7 max
0.8 max
For
general
use
BLM15HG601SN1B
BLM15HG102SN1D
1000±25% 1400±40% 250
1.1 max
1.2 max
BLM15HG102SN1B
BLM15HD601SN1D
600±25% 1400±40% 300
0.85 max
0.95 max
For
High speed
Signal line
BLM15HD601SN1B
BLM15HD102SN1D
1000±25% 2000±40% 250 1.25 max 1.35 max
BLM15HD102SN1B
BLM15HD182SN1D
1800±25% 2700±40% 200 2.2 max 2.3 max
BLM15HD182SN1B
BLM15HB121SN1D
120±25% 500±40% 300
0.7 max
0.8 max
BLM15HB121SN1B
BLM15HB221SN1D
220±25% 900±40% 250
1.0 max
1.1 max
BLM15HB221SN1B
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
4
.Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
:Electrode
1.0±0.05
0.5±0.05
0.25±0.1
0.5±0.05
(in mm)
Resistance element becomes
dominant at high frequencies.
()
Reference Spec.No.JENF243A-0024K-01 P2/9
MURATA MFG.CO.,LTD.
Reference Only
7.Specifications
7-1.Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3.
Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment :
KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
7-1-2 DC Resistance Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance and
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
7-2-4 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz
for 20 min
Total Amplitude 1.5mm or Acceleration 196m/s
2
whichever is smaller
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
7-2-6 Drop Products shall be no failure
after tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction
(Total 9 times)
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance
Meet item 3.
45mm
R340
F
Deflection
45mm
Product
Pressure jig
R0.5
Substrate
Side view
Reference Spec.No.JENF243A-0024K-01 P3/9
MURATA MFG.CO.,LTD.
Reference Only
No. Item Specification Test Method
72-7
Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle
Meet Table 1. 1 cycle:
1 step:-55 °C(+0 °C,-3 °C) / 30min±3min
2 step:Ordinary temp. / 3min max.
3 step:+125 °C(+3 °C,-0 °C) / 30min±3min
4 step: Ordinary temp. / 3min max.
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity Temperature : 70°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-3 Heat Life Temperature : 125°C±3°C
Applying Current : Rated Current (at Test temperature)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-4 Cold
Resistance
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
8. Specification of Packaging
8-1.Appearance and Dimensions
(8mm-wide paper tape)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
0.8max.
0.65(Typ.)
1.15(Typ.)
(in mm)
2.0±0.05
2.0±0.05
4.0±0.1
φ
1.5
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
Direction of Feed

BLM15HD182SN1D

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Ferrite Beads 1800ohms GHz HiSpd
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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