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905-29-2-15-2-B-0

P1-P3
4.5
905-29-2-12-2-B-0
905-29-2-15-2-B-0
Material: AL 6063
Finish: Black Anodize
PIN FIN HEAT SINK
905 Series
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to
devices from Intel, Broadcom, Xilinx, TI, Motorola and many more.
These heat sinks are designed for air flow applications in the
Telecom, Data Center, Networking, Cloud Computing, and many
more Industries.
PART #
HEIGHT
(mm)
CHIP SIZE
(mm)
NATURAL
CONVECTION
FORCED CONVECTION (C/W)
200 LFM
400 LFM
600 LFM
905-29-2-12-2-B-0
12
29
11.04 C/W
4.08 C/W
2.55 C/W
1.98 C/W
905-29-2-15-2-B-0
15
29
10.46 C/W
3.82 C/W
2.32 C/W
1.78 C/W
905-29-2-18-2-B-0
18
29
9.87 C/W
3.58 C/W
2.14 C/W
1.58 C/W
905-29-2-21-2-B-0
21
29
9.28 C/W
3.33 C/W
1.96 C/W
1.44 C/W
905-29-2-23-2-B-0
23
29
9.16 C/W
3.13 C/W
1.82 C/W
1.34 C/W
905-29-2-28-2-B-0
28
29
8.84 C/W
2.82 C/W
1.64 C/W
1.2 C/W
905-29-2-33-2-B-0
33
29
8.53 C/W
2.59 C/W
1.47 C/W
1.07 C/W
THERMAL PERFORMANCE:
0.5
1.5
2.5
3.5
200 LFM
400 LFM
600 LFM
Forced Convection
905-29-2-15-2-B-0
905-29-2-18-2-B-0
905-29-2-21-2-B-0
905-29-2-23-2-B-0
905-29-2-28-2-B-0
905-29-2-33-2-B-0
T h e r m a l C o o l i n g S o l u t i o n s f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
Series
Chip Size
Construction
Height
Chip Height
Finish
Interface
905-
19-
2-
12-
1-
B-
1
19
2= Pin Fin
12 = 11.6
1 = .9-2.1
B = BLK
ANO
0 = None
21
15 = 14.6
2 = 2.2-3.4
1 = T725
23
18 = 17.6
27
21 = 20.6
29
23 = 22.6
31
28 = 27.6
33
33 = 32.6
35
37.5
40
PIN FIN HEAT SINK
905 Series
ASSEMBLY INSTRUCTION:
Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and
the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm.
Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage
chip. Contact area is the edge of chip.
T h e r m a l C o o l i n g S o l u t i o n s f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
Random Vibration Test
Frequency ：5 Hz to 500 Hz
Acceleration ：3.13 grms
P.S.D ：0.01 g2/HZ (5 Hz)
0.02 g2/HZ (20 Hz to 500 Hz)
Test Axis ：X, Y, Z axis
Test Time ：10 mins (Each axis)
Total Test Time ：30 mins
SHOCK TEST SPECIFICATION：
Wave Form ：Half sine wave
Acceleration ：50 g
Duration Time ：11 ms
No. of Shock ：Each axis 3 times
Shock Direction ：±X, ±Y, ±Z axis
Reliability & Communication
Testing Instruments
Step 1: Hook the
clip under one
side of the BGA
chip set.
Step 2: Rotate
assembly down
until opposite
side clip engages
substrate edge of
BGA chip set.
Step 3: Make sure
the sop rods are
clearing from edges
of BGA chip set.
Step 4: Press firmly
down to make sure
clips fully engage
edges of chip set.
Heat Sink should not
move around easily.
P1-P3

905-29-2-15-2-B-0

Mfr. #:
Buy 905-29-2-15-2-B-0
Manufacturer:
Wakefield-Vette
Description:
Heat Sinks Chipset Heatsink with Clip, Pin Fin, 29mm Chip Size, 14.6mm Height, Aluminum, Black Anodized
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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