THERMAL DATA
Symbol Parameter SO20
(2)
SO(12+4+4)
(1)
Unit
R
th (j-pins)
Thermal resistance junction to pin – 14 (Typ.) °C/W
R
th (j-amb)
Thermal resistance junction to ambient mounted on
SMPCB2 board
77 to 97 – °C/W
T
jMon
Temperature-monitoring
Switch-off-level
Switch-on-level
160 to 190
140 to 170
°C
°C
(1) See SGS-THOMSON Microelectronics databook:"Thermal Management in Surface Mount Technology"
(2) See SGS-THOMSON Microelectronics databook:"Thermal characteristics of SO20"
OPERATING CONDITIONS
(The electrical characteristics are valid within the below defined operating
ranges, unless otherwise specified. The function will be guaranted by design until T
jMON
switch-OFF-level.
Symbol Parameter Value Unit
V
S
Supply Voltage 4.5 to 32 V
V
IN
Input pin voltage -24 to 45 V
V
EN
Enable pin voltage -24 to 45 V
V
OUT
, V
D
Output pin voltage -0.3 to 45 V
T
j
Junction temperature -40 to 150 °C
ELECTRICAL CHARACTERISTICS
(Refer to the test circuit, unless otherwise specified.)
Symbol Parameter Test Condition Min. Typ. Max. Unit
I
Q
Quiescent current -0.3V ≤ V
EN
≤ 0.5V;
V
S
= 14V; T
j
= 85°C
<2 10 µA
EN = high; V
S
≤ 14V 1.5 2 mA
Inputs IN1 - IN4, PRG
V
INIlow
Input voltage LOW -24 2.0 V
V
INhigh
Input voltage HIGH 2.8 45 V
I
IN
Input current -24V ≤ Vi ≤ 10V -10 15 µA
Enable Input EN
V
ENlow
Input voltage LOW -24 1 V
V
ENhigh
Input voltage HIGH 3.2 VS V
R
EN
Input impedance -24V < V
i
< 2.5V 10 KΩ
I
EN
Input current 2.5V ≤ Vi ≤ 25V 20 50 µA
Outputs OUT1-OUT4
R
DSon
Output ON-resistor to ground V
S
≥ 6V, I
O
= 0.3A
T
j
= 25°C
T
j
= 125°C
1.7 2.3
3.5
Ω
Ω
I
OLeak
Leakage current V
O
= V
S
= 14V; T
j
= 85°C ≤15µA
V
OClamp
Output voltage during clamping time < 200µs; 10mA ≤ Io ≤ 0.3A 45 52 60 V
I
OSC
Short-circuit current 400 700 1200 mA
C
O
Internal output capacities V
O
≥ 4.5V 100 pF
Diagnostic output DIAG
V
Dlow
Output voltage LOW I
DL
≤ 1mA 0.3 0.5 V
I
Dmax
Max. Output current Internal current limitation 1 5 15 mA
I
Dleak
Leakage current V
S
= 14V; T
J
= 85°C ≤ 0.1 1 µA
L9338
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