STPS1L30
4/7
Figure 11: Forward voltage drop versus
forward current (typical values, high level)
Figure 12: Forward voltage drop versus
forward current (maximum values, low level)
Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)
Figure 14: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB)
I (A)
FM
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
0.10
1.00
10.00
T =25°C
j
T =100°C
j
V (V)
FM
T =150°C
j
0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
0.0
0.5
1.0
1.5
2.0
2.5
3.0
I (A)
FM
T =25°C
j
T =125°C
j
V (V)
FM
T =150°C
(typical values)
j
T =100°C
j
012345
0
20
40
60
80
100
120
140
S(Cu)(cm²)
R (°C/W)
th(j-a)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0
20
40
60
80
100
120
S(Cu)(cm²)
R (°C/W)
th(j-a)