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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-3826EN - October 2, 2012
Figure 12. Test Circuit for Transient Immunity and Typical Waveforms (4-Pin Con guration)
8
7
6
5
1
2
3
4
I
F
V
CC
R
L
V
O
C
L
= 15 pF
V
FF
+
–
V
CM
Pulse Gen.
5 V
V
CM
V
O
t
r
t
f
V
OL
10%
90%
10%
90%
T
r
= t
f
= 80 ns
Switch at I
F
= 0 mA
V
O
Switch at I
F
= 4 mA
1500 V
Thermal Resistance Model for ACPL-K49U
The diagram of ACPL-K49U for measurement is shown in
Figure 13. Here, one die is heated rst and the tempera-
tures of all the dice are recorded after thermal equilib-
rium is reached. Then, the 2
nd
die is heated and all the
dice temperatures are recorded. With the known ambient
temperature, the die junction temperature and power
dissipation, the thermal resistance can be calculated. The
thermal resistance calculation can be cast in matrix form.
This yields a 2 by 2 matrix for our case of two heat sources.
R
11
R
12
X
P
1
=
T
1
R
21
R
22
P
2
T
2
1
2
3
4
8
7
6
5
Die 1:
LED
Die 2:
Detector
Figure 13, Diagram of ACPL-K49U for measurement
R
11
: Thermal Resistance of Die1 due to heating of Die1
R
12
: Thermal Resistance of Die1 due to heating of Die2.
R
21
: Thermal Resistance of Die2 due to heating of Die1.
R
22
: Thermal Resistance of Die2 due to heating of Die2.
P
1
: Power dissipation of Die1 (W).
P
2
: Power dissipation of Die2 (W).
T
1
: Junction temperature of Die1 due to heat from all dice (°C).
T
2
: Junction temperature of Die2 due to heat from all dice.
T
a
: Ambient temperature.
T
1
: Temperature di erence between Die1 junction and ambient (°C).
T
2
: Temperature deference between Die2 junction and ambient (°C).
T
1
= (R
11
x P
1
+ R
12
x P
2
) + T
a
T
2
= (R
21
x P
1
+ R
22
x P
2
) + T
a
Measurement data on a low K board:
R
11
= 160°C/W, R
12
= R
21
= 74°C/W, R
22
= 115°C/W