(3) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directly touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows:
Soldering iron power output: 80W max.
Temperature of soldering iron tip: 350°C
Diameter of soldering iron end: 3.0mm max.
Soldering time: within 3 s
3. Mounting Instructions
(4) PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Poor example
except LQH3NP/44P/5BP
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Good example
a
b
Poor example
LQH3NP/44P/5BP
The electrode part of the product should be located
like the picture to the mechanical stress.
Good example
(1) Land Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown) cause floating and
electrode leaching.
(2) Land Pattern Designing (LQH series)
Please follow the recommended patterns.
Otherwise, their performance which includes electrical
performance or solderability may be affected, or result to
“position shift” in soldering process.
(3) Magnetic Coupling
Since some chip inductors (chip coils) are constructed
like an open magnetic circuit, narrow spacing between
inductors (coils) may cause magnetic coupling.
LQM, LQH66S and LQH_P series have a magnetically
shielded structure. The structure makes their coupling
coefficient smaller than that of conventional chip
inductors (chip coils).
d
c
Magnetic Coupling
Land
Solder Resist
electrode
electrode
Continued on the following page.
Inductor for Power Lines (Power Inductor) Soldering and Mounting
