OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

MPXHZ6400AC6T1

P1-P3P4-P6P7-P9P10-P12P13-P15
MPXH6400A
Sensors
NXP B.V. 7
Figure 8. Pressure error band
Error Limits for Pressure
± 5.5 (kPa)
3.0
2.0
1.0
-1.0
-2.0
-4.0
0.0
4.0
-3.0
- 5.0
- 6.0
5.0
6.0
20
Pressure (in kPa)
Pressure Error (kPa)
Pressure Error (Max)
20 to 400 (kPa) ±5.5 (kPa)
40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400
MPXH6400A
Sensors
8 NXP B.V.
4 Package Information
4.1 Minimum recommended footprint for surface mounted applications
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
Figure 9. SSOP footprint
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
MPXH6400A
Sensors
NXP B.V. 9
4.2 Package Dimensions
This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99066A.pdf.
Case 98ARH99066A, super small outline package, surface mount
P1-P3P4-P6P7-P9P10-P12P13-P15

MPXHZ6400AC6T1

Mfr. #:
Buy MPXHZ6400AC6T1
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors SSOP INTEG W/PORT SIFEL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet