Datasheet
12/17
BA00DD0xx series BA00CC0xx series
TSZ02201-0R6R0A600080-1-2
26.Jun.2012 Rev.001
TSZ22111･15･001
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
To225FP-5
0
1
2
3
4
5
6
7
8
9
10
0 25 50 75 100 125 150
Ambient temperature:Ta(℃）
Power Dissipation:Pd(W
0
5
10
15
20
25
0 25 50 75 100 125 150
Ambient temperature:Ta(℃）
Power Dissipation:Pd(W
●Power Dissipation
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.28 through 30.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tj
MAX.
Fig.29 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a
normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows:
Pc = (Vcc-Vo)×Io＋Vcc×Icca
Acceptable loss Pd≦Pc
Solving this for load current Io in order to operate within the acceptable loss,
Io≦
（Please refer to Fig.8 and 20 for Icca.）
It is then possible to find the maximum load current Io
MAX with respect to the applied voltage Vcc at the time of thermal design.
Pd – Vcc×Icca
Vcc－Vo
Vcc：
Vo：
Io：
Icca：
Input voltage
Output voltage
Load current
Circuit current
（1） When using a maximum heat sick : θj-c=6.25(℃/W)
（2） When using an IC alone : θj-c=62.5(℃/W)
（1）20.0
（2）2.0
Fig.29
0.0
0.4
0.8
1.2
1.6
2.0
0 25 50 75 100 125 150
Ambient temperature:Ta(℃）
Power Dissipation:Pd(W
1.30
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
TO252-5
Fig.30
Board size : 70×70×1.6 ㎜
（board contains a thermal）
Board front copper foil area : 10.5×10.5 ㎜
2
①2-layer board (back surface copper foil area :15×15 ㎜
2
)
②2-layer board (back surface copper foil area :70×70 ㎜
2
)
③4-la
er board
back surface co
er foil area :70×70 ㎜
2
③7.3W
②5.5W
①2.3W
HRP5
Fig.28
TO220FP-5
