SUD70090E-GE3

SUD70090E
www.vishay.com
Vishay Siliconix
S16-0163-Rev. A, 01-Feb-16
1
Document Number: 65437
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 100 V (D-S) MOSFET
Ordering Information:
SUD70090E-GE3 (lead (Pb)-free and halogen-free)
FEATURES
ThunderFET
®
power MOSFET
Maximum 175 °C junction temperature
•Q
gd
/ Q
gs
ratio < 1 optimizes switching
characteristics
100 % R
g
and UIS tested
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
•DC/DC converter
Power tools
Motor drive switch
DC/AC inverter
Battery management
Notes
a. Duty cycle 1 %.
b. When mounted on 1" square PCB (FR4 material).
c. Package limited.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
() MAX. I
D
(A)
c
Q
g
(TYP.)
100
0.0089 at V
GS
= 10 V 50
33 nC
0.0093 at V
GS
= 7.5 V 50
TO-252
Top View
TO
G
D
S
Drain connected to tab
N-Channel MOSFET
G
D
S
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
100
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
50
c
A
T
C
= 70 °C 50
c
Pulsed Drain Current (t = 100 μs) I
DM
120
Avalanche Current I
AS
40
Single Avalanche Energy
a
L = 0.1 mH E
AS
80 mJ
Maximum Power Dissipation
a
T
C
= 25 °C
P
D
125
W
T
C
= 70 °C
b
87.5
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to +175 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL LIMIT UNIT
Junction-to-Ambient (PCB Mount)
b
R
thJA
40
°C/W
Junction-to-Case (Drain) R
thJC
1.2
SUD70090E
www.vishay.com
Vishay Siliconix
S16-0163-Rev. A, 01-Feb-16
2
Document Number: 65437
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 100 - -
V
Gate Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2 - 4
Gate-Body Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 250 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 100 V, V
GS
= 0 V - - 1
μA
V
DS
= 100 V, V
GS
= 0 V, T
J
= 125 °C - - 150
V
DS
= 100 V, V
GS
= 0 V, T
J
= 175 °C - - 5 mA
On-State Drain Current
a
I
D(on)
V
DS
10 V, V
GS
= 10 V 50 - - A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 20 A - 0.0074 0.0089
V
GS
= 7.5 V, I
D
= 15 A - 0.0077 0.0093
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 10 A - 38 - S
Dynamic
b
Input Capacitance C
iss
V
GS
= 0 V, V
DS
= 50 V, f = 1 MHz
- 1950 -
pFOutput Capacitance C
oss
- 845 -
Reverse Transfer Capacitance C
rss
-54-
Total Gate Charge
c
Q
g
V
DS
= 50 V, V
GS
= 10 V, I
D
= 20 A
-3350
nCGate-Source Charge
c
Q
gs
-8.8-
Gate-Drain Charge
c
Q
gd
-7.5-
Gate Resistance R
g
f = 1 MHz 0.7 3.5 7
Turn-On Delay Time
c
t
d(on)
V
DD
= 50 V, R
L
= 5
I
D
10 A, V
GEN
= 10 V, R
g
= 1
-1530
ns
Rise Time
c
t
r
-2754
Turn-Off Delay Time
c
t
d(off)
-3672
Fall Time
c
t
f
-4590
Drain-Source Body Diode Ratings and Characteristics
b
(T
C
= 25 °C)
Pulsed Current (t = 100 μs) I
SM
--120A
Forward Voltage
a
V
SD
I
F
= 10 A, V
GS
= 0 V - 0.8 1.5 V
Reverse Recovery Time t
rr
I
F
= -10 A, dI/dt = 100 A/μs
- 77 116 ns
Peak Reverse Recovery Charge I
RM(REC)
-4.26.3A
Reverse Recovery Charge Q
rr
- 145 365 nC
SUD70090E
www.vishay.com
Vishay Siliconix
S16-0163-Rev. A, 01-Feb-16
3
Document Number: 65437
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
Transfer Characteristics
Capacitance
Transconductance
10
100
1000
10000
0
30
60
90
120
012345
Axis Title
1st line
2nd line
2nd line
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
2nd line
V
GS
= 10 V thru 6 V
V
GS
= 5 V
V
GS
= 4 V
10
100
1000
10000
0
0.003
0.006
0.009
0.012
0.015
0306090120
Axis Title
1st line
2nd line
2nd line
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
2nd line
V
GS
= 7.5 V
V
GS
= 10 V
10
100
1000
10000
0
2
4
6
8
10
0 7 14 21 28 35
Axis Title
1st line
2nd line
2nd line
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
2nd line
I
D
= 15 A
V
DS
= 30 V
10
100
1000
10000
0
25
50
75
100
02468
Axis Title
1st line
2nd line
2nd line
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
10
100
1000
10000
0
600
1200
1800
2400
3000
3600
0 20406080100
Axis Title
1st line
2nd line
2nd line
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
2nd line
C
rss
C
oss
C
iss
10
100
1000
10000
0
15
30
45
60
0 3.0 6.0 9.0 12.0 15.0
Axis Title
1st line
2nd line
2nd line
g
fs
- Transconductance (S)
I
D
- Drain Current (A)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C

SUD70090E-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 100V Vds 20V Vgs DPAK (TO-252)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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