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SI7060-B-00-IV

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
Table 7.1. SOT23-5 5-Pin Package Dimensions
Dimension Min Max
A -- 1.25
A1 0.00 0.10
A2 0.85 1.15
b 0.30 0.50
c 0.10 0.20
D 2.90 BSC
E 2.75 BSC
E1 1.60 BSC
e 0.95 BSC
e1 1.90 BSC
L 0.30 0.60
L2 0.25 BSC
θ 0° 8°
aaa 0.15
bbb 0.20
ccc 0.10
ddd 0.20
Note:
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2.
Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-193, Variation AB.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
Si7060 Data Sheet
Package Outline
silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 13
8. Land Patterns
8.1 SOT23-5 5-Pin PCB Land Pattern
Dimension (mm)
C 2.70
E 0.95
X 1.05
Y 0.60
Note:
General
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri-
cation Allowance of 0.05 mm.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
Si7060 Data Sheet
Land Patterns
silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 14
9. Top Marking
9.1 SOT23-5 5-Pin Top Marking
Note: TTTT is a manufacturing code.
Si7060 Data Sheet
Top Marking
silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 15
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

SI7060-B-00-IV

Mfr. #:
Buy SI7060-B-00-IV
Manufacturer:
Silicon Labs
Description:
Board Mount Temperature Sensors 1 C maximum digital I2C temperature sensors
Lifecycle:
New from this manufacturer.
Delivery:
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