Reference Spec.No.JENF243A-0029F-01 P5/8
MURATA MFG.CO.,LTD.
Reference Only
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (vehicles, trains, ships, etc.)
(4)Power plant control equipment (9)Applications of similar complexity and /or reliability requirements
(5)Medical equipment to the applications listed in the above
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
• Standard land dimensions (Reflow soldering)
(in mm)
10-2.Soldering Conditions
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150~180°C 、90s±30s
Heating above 220°C、30s~60s above 230°C、60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
Chip Ferrite Bead
Solder Resist
Pattern
0.5
0.4
1.2~1.4
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.