MRF6S19100HR5

MRF6S19100HR3 MRF6S19100HSR3
1
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistors
N-Channel Enhancement - Mode Lateral MOSFETs
Designed for N-CDMA base station applications with frequencies from 1930
to 1990 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applica-
tions. To be used in Class AB for PCN- PCS/cellular radio and WLL
applications.
Typical 2-Carrier N-CDMA Performance: V
DD
= 28 Volts, I
DQ
= 900 mA,
P
out
= 22 Watts Avg., f = 1987 MHz, IS-95 (Pilot, Sync, Paging, Traffic
Codes 8 Through 13) Channel Bandwidth = 1.2288 MHz. PAR = 9.8 dB
@ 0.01% Probability on CCDF.
Power Gain — 16.1 dB
Drain Efficiency — 28%
IM3 @ 2.5 MHz Offset — -37 dBc in 1.2288 MHz Channel Bandwidth
ACPR @ 885 kHz Offset — -51 dBc in 30 kHz Channel Bandwidth
Capable of Handling 10:1 VSWR, @ 28 Vdc, 1960 MHz, 100 Watts CW
Output Power
Features
Characterized with Series Equivalent Large- Signal Impedance Parameters
Internally Matched for Ease of Use
Qualified Up to a Maximum of 32 V
DD
Operation
Integrated ESD Protection
Designed for Lower Memory Effects and Wide Instantaneous Bandwidth
Applications
RoHS Compliant
In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain-Source Voltage V
DSS
-0.5, +68 Vdc
Gate-Source Voltage V
GS
-0.5, +12 Vdc
Storage Temperature Range T
stg
- 65 to +150 °C
Case Operating Temperature T
C
150 °C
Operating Junction Temperature
(1,2)
T
J
225 °C
Table 2. Thermal Characteristics
Characteristic Symbol Value
(2,3)
Unit
Thermal Resistance, Junction to Case
Case Temperature 80°C, 100 W CW
Case Temperature 77°C, 22 W CW
R
θ
JC
0.44
0.50
°C/W
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access
MTTF calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes - AN1955.
Document Number: MRF6S19100H
Rev. 5, 12/2008
Freescale Semiconductor
Technical Data
MRF6S19100HR3
MRF6S19100HSR3
1930-1990 MHz, 22 W AVG., 28 V
2 x N- CDMA
LATERAL N- CHANNEL
RF POWER MOSFETs
CASE 465A- 06, STYLE 1
NI- 780S
MRF6S19100HSR3
CASE 465- 06, STYLE 1
NI- 780
MRF6S19100HR3
Freescale Semiconductor, Inc., 2004-2006, 2008. All rights reserved.
2
RF Device Data
Freescale Semiconductor
MRF6S19100HR3 MRF6S19100HSR3
Table 3. ESD Protection Characteristics
Test Methodology Class
Human Body Model (per JESD22- A114) 3A (Minimum)
Machine Model (per EIA/JESD22- A115) B (Minimum)
Charge Device Model (per JESD22- C101) IV (Minimum)
Table 4. Electrical Characteristics (T
C
= 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(V
DS
= 68 Vdc, V
GS
= 0 Vdc)
I
DSS
10 µAdc
Zero Gate Voltage Drain Leakage Current
(V
DS
= 28 Vdc, V
GS
= 0 Vdc)
I
DSS
1 µAdc
Gate-Source Leakage Current
(V
GS
= 5 Vdc, V
DS
= 0 Vdc)
I
GSS
1 µAdc
On Characteristics
Gate Threshold Voltage
(V
DS
= 10 Vdc, I
D
= 250 µAdc)
V
GS(th)
1 2 3 Vdc
Gate Quiescent Voltage
(V
DD
= 28 Vdc, I
D
= 900 mAdc, Measured in Functional Test)
V
GS(Q)
2 2.8 4 Vdc
Drain-Source On -Voltage
(V
GS
= 10 Vdc, I
D
= 2.2 Adc)
V
DS(on)
0.1 0.21 0.3 Vdc
Dynamic Characteristics
(1)
Reverse Transfer Capacitance
(V
DS
= 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
C
rss
1.5 pF
Functional Tests (In Freescale Test Fixture, 50 ohm system) V
DD
= 28 Vdc, I
DQ
= 900 mA, P
out
= 22 W Avg., f = 1987 MHz, 2-carrier
N- CDMA, 1.2288 MHz Channel Bandwidth Carriers. ACPR measured in 30 kHz Channel Bandwidth @ ±885 kHz Offset. IM3 measured in
1.2288 MHz Channel Bandwidth @ ±2.5 MHz Offset. PAR = 9.8 dB @ 0.01% Probability on CCDF.
Power Gain G
ps
15 16.1 18 dB
Drain Efficiency η
D
26 28 %
Intermodulation Distortion IM3 -37 -35 dBc
Adjacent Channel Power Ratio ACPR -51 -48 dBc
Input Return Loss IRL -15 -9 dB
1. Part is internally matched both on input and output.
MRF6S19100HR3 MRF6S19100HSR3
3
RF Device Data
Freescale Semiconductor
Figure 1. MRF6S19100HR3(HSR3) Test Circuit Schematic
Z7 0.091 x 0.900 Microstrip
Z8 0.493 x 0.900 Microstrip
Z9 0.440 x 0.195 Microstrip
Z10 0.470 x 0.084 Microstrip
Z11 0.735 x 0.084 Microstrip
PCB Arlon CuClad 250GX- 0300 -55- 22, 0.030, ε
r
= 2.55
Z1 0.130 x 0.084 Microstrip
Z2 0.360 x 0.084 Microstrip
Z3 0.260 x 0.084 Microstrip
Z4 0.950 x 0.084 Microstrip
Z5 0.457 x 0.940 Microstrip
Z6 0.083 x 0.940 Microstrip
C5
R2
V
BIAS
C4
+
R1
RF
INPUT
DUT
Z1 Z2 Z3 Z4 Z5 Z6
C1 C2
C3
Z7 Z8 Z9 Z10 Z11
RF
OUTPUT
C6
C7
V
SUPPLY
C8
+
C9
+
C10
+
C11 C12
+
B1
Table 5. MRF6S19100HR3(HSR3) Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
B1 RF Bead 2743019447 Fair-Rite
C1, C2 0.6- 4.5 pF Variable Capacitors, Gigatronics 27271SL Johanson Dielectrics
C3 15 pF Chip Capacitor ATC100B150CT500XT ATC
C4, C7 5.6 pF Chip Capacitors ATC100B5R6JT500XT ATC
C5 1 µF, 50 V Tantalum Chip Capacitor T491C105K050AT Kemet
C6 43 pF Chip Capacitor ATC100B430CT500XT ATC
C8, C10 22 µF, 35 V Tantalum Chip Capacitors T491X226K035AT Kemet
C9 10 µF, 35 V Tantalum Chip Capacitor T491C106K035AT Kemet
C11 0.1 µF Chip Capacitor C1825C14J5RAC Kemet
C12 100 µF, 50 V Electrolytic Capacitor MCHT101M1HB-1017- RH Multicomp
R1 12 , 1/4 W Chip Resistor CRCW120612R0FKEA Vishay
R2
2 kW, 1/4 W Chip Resistor
CRCW12062001FKEA Vishay

MRF6S19100HR5

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
FET RF 68V 1.99GHZ NI-780
Lifecycle:
New from this manufacturer.
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