Ceramic transient voltage suppressors B72660M0461K093
SMD Varistors, Monolithic (CU) CU4032K460G2K1
KB VS PE 2009-02-16
Please read Cautions and warnings and Page 5 of 13
Important notes at the end of this document.
Recommended soldering temperature profiles
Reflow soldering temperature profile
TPT0892-3-E
T
25
Smin
t
S
t 25 ˚C to peak
Preheat
Ramp-down
Time
L
Critical zone
T
Temperature
T
L
T
p
Ramp-up
Smax
t
L
T
t
p
to T
p
Profile feature Sn-Pb eutectic assembly Pb-free assembly
Average ramp-up rate (T
Smax
to T
p
) 3 °C/ second max. 3 °C/ second max.
Preheat
- Temperature min (T
Smin
)
- Temperature max (T
Smax
)
- Time (t
Smin
to t
Smax
)
100 °C
150 °C
60 … 120 seconds
150 °C
200 °C
60 … 180 seconds
Time maintained above
- Temperature min (T
L
)
- Time (t
L
)
183 °C
60 … 150 seconds
217 °C
60 … 150 seconds
Peak classification temperature
(T
p
)
220 °C … 240 °C 240 °C … 260 °C
Time within 5 °C of actual peak
temperature (t
p
)
10 … 30 seconds 20 … 40 seconds
Ramp-down rate 6 °C/ second max. 6 °C/ second max.
Time 25 °C to peak temperature 6 minutes max. 8 min utes max.
Notes: All temperatures refer to topside of the package, measured on the package body surface.
Max. number of reflow cycles: 3
