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74HCT30N,652
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74HC_HCT30
All information prov
ided in this docu
ment is subje
ct to legal discla
imers.
© NXP B.V
.
2012. All rights rese
rved.
Product data sheet
Rev
. 6
— 27 December 2012
10 of 16
NXP Semiconductors
74HC30; 74HCT30
8-input NAND gate
Fig 8.
Package outline SOT108-1 (SO1
4)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
7
8
1
14
y
076E06
MS-012
pin 1 index
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.35
0.34
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
99-12-27
03-02-19
0
2.5
5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
74HC_HCT30
All information prov
ided in this docu
ment is subje
ct to legal discla
imers.
© NXP B.V
.
2012. All rights rese
rved.
Product data sheet
Rev
. 6
— 27 December 2012
1
1 of 16
NXP Semiconductors
74HC30; 74HCT30
8-input NAND gate
Fig 9.
Package outline SOT337-1 (SSOP14)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
1.25
0.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
8
0
o
o
0.13
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT337-1
99-12-27
03-02-19
(1)
w
M
b
p
D
H
E
E
Z
e
c
v
M
A
X
A
y
1
7
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
MO-150
pin 1 index
0
2.5
5 mm
scale
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
A
max.
2
74HC_HCT30
All information prov
ided in this docu
ment is subje
ct to legal discla
imers.
© NXP B.V
.
2012. All rights rese
rved.
Product data sheet
Rev
. 6
— 27 December 2012
12 of 16
NXP Semiconductors
74HC30; 74HCT30
8-input NAND gate
Fig 10.
Package ou
tline SOT402-1 (TSSOP14)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.72
0.38
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
17
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
A
max.
1.1
pin 1 index
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74HCT30N,652
Mfr. #:
Buy 74HCT30N,652
Manufacturer:
NXP Semiconductors
Description:
Logic Gates 8-INPUT NAND GATE
Lifecycle:
New from this manufacturer.
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