Symbol Min Typ Max Units
BV
DSS
-60 V
V
DS
=-48V, V
GS
=0V -1
T
J
=55°C -5
I
GSS
±100 nA
V
GS(th)
Gate Threshold Voltage
-1.2 -1.9 -2.4 V
I
D(ON)
On state drain current
-80 A
32 40
T
J
=125°C 53
43 55 mΩ
g
FS
32 S
V
SD
-0.73 -1 V
I
S
-30 A
C
iss
2977 3600 pF
C
oss
241 pF
C
rss
153 pF
R
g
2 2.4 Ω
Q
g
(10V)
44 54 nC
Q
g
(4.5V)
22.2 28 nC
Q
gs
9 nC
Q
gd
10 nC
t
D(on)
12 ns
t
r
14.5 ns
mΩ
V
GS
=-10V, V
DS
=-30V, I
D
=-20A
Total Gate Charge
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
Gate resistance f=1MHz
I
DSS
µAZero Gate Voltage Drain Current
Drain-Source Breakdown Voltage
I
D
=-250µA, VGS=0V
R
DS(ON)
Static Drain-Source On-Resistance
Gate Source Charge
Gate Drain Charge
Total Gate Charge
SWITCHING PARAMETERS
Turn-On DelayTime
V
DS
=0V, V
GS
=±20V
Maximum Body-Diode Continuous Current
Input Capacitance
Gate-Body leakage current
V
GS
=-10V, V
DS
=-30V, R
L
=1.5Ω,
Diode Forward Voltage
DYNAMIC PARAMETERS
V
GS
=-4.5V, I
D
=-20A
Turn-On Rise Time
Reverse Transfer Capacitance
V
GS
=0V, V
DS
=-30V, f=1MHz
V
DS
=V
GS,
I
D
=-250µA
Output Capacitance
Forward Transconductance
I
S
=-1A,V
GS
=0V
V
DS
=-5V, I
D
=-20A
V
GS
=-10V, I
D
=-20A
V
GS
=-10V, V
DS
=-5V
t
f
15 ns
t
rr
40
50 ns
Q
rr
59 nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Charge
Body Diode Reverse Recovery Time
I
F
=-20A, dI/dt=100A/µs
Turn-Off Fall Time
I
F
=-20A, dI/dt=100A/µs
A. The value of R
θJA
is measured with the device mounted on 1in
2
FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The Power
dissipation P
DSM
is based on R
θJA
t≤ 10s and the maximum allowed junction temperature of 150°C. The value in any given application depends on
the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation P
D
is based on T
J(MAX)
=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Single pulse width limited by junction temperature T
J(MAX)
=175°C.
D. The R
θJA
is the sum of the thermal impedance from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=175°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in
2
FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C.
Rev.6.0: October 2014 www.aosmd.com Page 2 of 6
