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PACDN1404CG

P1-P3P4-P5
© Semiconductor Components Industries, LLC, 2011
November, 2017 − Rev. 5
1 Publication Order Number:
PACDN1404/D
PACDN1404
ESD Protection Diode
Arrays Chip Scale Package
Product Description
The PACDN1404 and PACDN1408 are 4− and 8−channel surge
protection arrays that provide a very high level of protection for
sensitive electronic components that may be subjected to ESD.
These devices are designed and characterized to safely dissipate
ESD strikes at levels well beyond the maximum requirements set forth
in the IEC 61000−4−2 international standard (Level 4, ±8 kV contact
discharge). All I/Os are rated at ±25 kV using the IEC 61000−4−2
contact discharge method. Using the MIL−STD−883D (Method 3015)
specification for Human Body Model (HBM) ESD, all pins are
protected for contact discharges to greater than ±30 kV.
The Chip Scale Package format of these devices provide extremely
small footprints that are necessary in portable electronics such as
cellular phones, PDAs, internet appliances and PCs. The large solder
bumps allow for standard attachments to laminate boards without the
use of underfill. The PACDN1404 and PACDN1408 are packaged in
RoHS−compliant, lead−free finishing.
Features
• Four or Eight surge protection in a Single Package
• In−System Electrostatic Discharge (ESD) Protection to ±25 kV
Contact Discharge per IEC 61000−4−2 International Standard
• Compact Chip Scale Package (CSP) in a 0.65 mm Pitch Format
Saves Board Space and Eases Layout in Space Critical Applications
Compared to Discrete Solutions and Traditional Wire Bonded
Packages
• 6− and 10−Bump WLCSPs
• These Devices are Pb−Free and are RoHS Compliant
Applications
• ESD Protection for Sensitive Electronic Equipment
• I/O Port, Keypad and Button Circuitry Protection for Portable
Devices
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Cameras and Camcorders
• Notebooks
• Desktop PCs
www.onsemi.com
WLCSP6
CG SUFFIX
CASE 567BD
WLCSP10
CG SUFFIX
CASE 567BM
MARKING DIAGRAM
D14
D14 = PACDN1404CG
DN1408 = PACDN1408CG
ELECTRICAL SCHEMATIC
A1 A3
PACDN1404
B1 B3
A2
B2
A2 A5
PACDN1408
B2 B5
A3
B3
A4
B4
A1
B1
Device Package Shipping
†
ORDERING INFORMATION
PACDN1404CG WLCSP6
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
PACDN1408CG WLCSP10
(Pb−Free)
3500/Tape & Reel
DN1408
PACDN1404
www.onsemi.com
2
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
PACDN1404
6−Bump WLCSP Package
Orientation
Marking
A
B1 B2 B3
A1 A2 A3
D14
+
B
123
Bottom View
(Bumps Up View)
Top View
(Bumps Down View)
PACDN1408
10−Bump WLCSP Package
A
B1 B2 B3
A1 A2 A3
DN1408
B
123
Bottom View
(Bumps Up View)
B4 B5
A4 A5
Orientation
Marking
+
45
SPECIFICATIONS
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range −65 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 2. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range −40 to +85 °C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter Conditions Min Typ Max Units
V
REV
Reverse Standoff Voltage
I
DIODE
= 10 mA
5.5 V
I
LEAK
Leakage Current V
IN
= 3.3 V DC 100 nA
V
SIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10 mA
5.6
−1.2
6.8
−0.8
8.0
−0.4
V
V
ESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883,
Method 3015
b) Contact Discharge per
IEC 61000−4−2 Level 4
(Note 2)
±30
±25
kV
V
CL
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Note 2)
+12
−8
V
C Channel Capacitance
At 2.5 V DC, f = 1 MHz
39 47 pF
1. T
A
= 25°C unless otherwise specified. GND in this document refers to the lower supply voltage.
2. ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground.
PACDN1404
www.onsemi.com
3
APPLICATION INFORMATION
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition Non−Solder Mask Defined Pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (Laser Cut, 5% Tapered Walls) 0.300 mm Round
Solder Flux Ratio 50/50 by Volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous (183°C) 60 seconds
Maximum Soldering Temperature for Lead−free Devices Using a Lead−free Solder Paste 260°C
Figure 1. Recommended Non−Solder Mask Defined Pad Illustration
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 2. Lead−free (SnAgCu) Solder Ball Reflow Profile
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (5C)
P1-P3P4-P5

PACDN1404CG

Mfr. #:
Buy PACDN1404CG
Manufacturer:
ON Semiconductor
Description:
ESD Suppressors / TVS Diodes 4 CH. ESD PROTECTION
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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