Version 1.5 BP 104 S
2018-02-23 7
Approximate Weight:
44 mg
Recommended Solder Pad
Dimensions in mm.
2018-02-23 8
Version 1.5 BP 104 S
Reflow Soldering Profile
Product complies to MSL Level 4 acc. to JEDEC J-STD-020E
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*
)
25 °C to 150 °C
2 3 K/s
Time t
S
T
Smin
to T
Smax
t
S
t
L
t
P
T
L
T
P
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time
25 °C to T
P
Time within 5 °C of the specified peak
temperature T
P
- 5 K
Ramp-down rate*
T
P
to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*
)
T
Smax
to T
P
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
Version 1.5 BP 104 S
2018-02-23 9
Taping
Dimensions in mm.
Tape and Reel
12 mm tape with 1500 pcs. on ∅ 180 mm reel
D
0
2
P
P
0
1
P
W
F E
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D

BP 104 S-Z

Mfr. #:
Manufacturer:
OSRAM Opto Semiconductors
Description:
Photodiodes PHOTODIODE, SMT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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