MPC962305DT-1H

MPC962305 MPC962309
MOTOROLA 7 TIMING SOLUTIONS
PACKAGE DIMENSIONS
STYLE 4:
PIN 1. ANODE
2. ANODE
3. ANODE
4. ANODE
5. ANODE
6. ANODE
7. ANODE
8. COMMON CATHODE
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. COLLECTOR
4. EMITTER
5. EMITTER
6. BASE
7. BASE
8. EMITTER
STYLE 2:
PIN 1. COLLECTOR, DIE, #1
2. COLLECTOR, #1
3. COLLECTOR, #2
4. COLLECTOR, #2
5. BASE, #2
6. EMITTER, #2
7. BASE, #1
8. EMITTER, #1
STYLE 3:
PIN 1. DRAIN, DIE #1
2. DRAIN, #1
3. DRAIN, #2
4. DRAIN, #2
5. GATE, #2
6. SOURCE, #2
7. GATE, #1
8. SOURCE, #1
STYLE 6:
PIN 1. SOURCE
2. DRAIN
3. DRAIN
4. SOURCE
5. SOURCE
6. GATE
7. GATE
8. SOURCE
STYLE 5:
PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. DRAIN
5. GATE
6. GATE
7. SOURCE
8. SOURCE
STYLE 7:
PIN 1. INPUT
2. EXTERNAL BYPASS
3. THIRD STAGE SOURCE
4. GROUND
5. DRAIN
6. GATE 3
7. SECOND STAGE Vd
8. FIRST STAGE Vd
STYLE 8:
PIN 1. COLLECTOR, DIE #1
2. BASE, #1
3. BASE, #2
4. COLLECTOR, #2
5. COLLECTOR, #2
6. EMITTER, #2
7. EMITTER, #1
8. COLLECTOR, #1
STYLE 9:
PIN 1. EMITTER, COMMON
2. COLLECTOR, DIE #1
3. COLLECTOR, DIE #2
4. EMITTER, COMMON
5. EMITTER, COMMON
6. BASE, DIE #2
7. BASE, DIE #1
8. EMITTER, COMMON
STYLE 10:
PIN 1. GROUND
2. BIAS 1
3. OUTPUT
4. GROUND
5. GROUND
6. BIAS 2
7. INPUT
8. GROUND
STYLE 11:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
STYLE 12:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 14:
PIN 1. N-SOURCE
2. N-GATE
3. P-SOURCE
4. P-GATE
5. P-DRAIN
6. P-DRAIN
7. N-DRAIN
8. N-DRAIN
STYLE 13:
PIN 1. N.C.
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 15:
PIN 1. ANODE 1
2. ANODE 1
3. ANODE 1
4. ANODE 1
5. CATHODE, COMMON
6. CATHODE, COMMON
7. CATHODE, COMMON
8. CATHODE, COMMON
STYLE 16:
PIN 1. EMITTER, DIE #1
2. BASE, DIE #1
3. EMITTER, DIE #2
4. BASE, DIE #2
5. COLLECTOR, DIE #2
6. COLLECTOR, DIE #2
7. COLLECTOR, DIE #1
8. COLLECTOR, DIE #1
STYLE 17:
PIN 1. VCC
2. V2OUT
3. V1OUT
4. TXE
5. RXE
6. VEE
7. GND
8. ACC
STYLE 18:
PIN 1. ANODE
2. ANODE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. CATHODE
8. CATHODE
L
h
X 45˚
θ
C
SEATING
PLANE
S
B
M
0.25 A
S
C
B
A1
C
A
0.10
1
4
58
M
B
M
0.25
D
E
H
A
B
e
DIM MIN MAX
MILLIMETERS
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49
C 0.19 0.25
D 4.80 5.00
E
1.27 BSCe
3.80 4.00
H 5.80 6.20
h
L 0.40 1.25
q
0.25 0.50
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
SEATING
PLANE
0.49
16X
B
M
0.25 AT
0.35
1.75
1.35
0.25
0.10
6
T
16X
0.1 T
1.27
14X
89
116
8X
6.2
5.8
M
0.25 B
4
10.0
9.8
A
4.0
3.8
B
P
IN 1 INDEX
PIN'S
NUMBER
5
AA
0.50
X45˚
0.25
1.25
0.40
0.25
0.19
SECTION A-A
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
3. DATUMS A AND B TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE
INTER-LEAD FLASH OR PROTRUSIONS.
INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.25MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.62MM.
D SUFFIX
16-LEAD SOIC PACKAGE
CASE 751B-05
ISSUE K
D SUFFIX
8-LEAD SOIC PACKAGE
CASE 751-06
ISSUE T
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cale Semiconductor,
I
Freescale Semiconductor, Inc.
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MPC962305 MPC962309
TIMING SOLUTIONS 8 MOTOROLA
PACKAGE DIMENSIONS
SECTION N-N
J
J1
K
K1
CASE 948J-01
ISSUE O
DATE 08/21/95
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25
(0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
SEE DETAIL E
-W-
SEATING
PLANE
C
D
H
G
0.10 (0.004)
-T-
IDENT.
PIN 1
1
4
8
5
B
A
L
2X L/2
-U-
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
-V-
8x REFK
DETAIL E
F
M
0.25 (0.010)
N
N
DT SUFFIX
8-LEAD TSSOP PACKAGE
CASE 948J-01
ISSUE O
Frees
cale Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...
MPC962305 MPC962309
MOTOROLA 9 TIMING SOLUTIONS
PACKAGE DIMENSIONS
DT SUFFIX
16-LEAD TSSOP PACKAGE
CASE 948F-01
ISSUE O
SECTION N-N
J
J1
K
K1
CASE 948F-01
ISSUE O
DATE 12/20
/
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
SEATING
PLANE
C
D
H
G
0.10 (0.004)
-T-
IDENT.
PIN 1
1
8
16
9
B
A
L
2X L/2
-U-
S
U0.15 (0.006) T
U0.15 (0.006) T
U
M
0.10 (0.004) VT
-V-
16X REF
K
DETAIL E
-W-
DETAIL E
F
M
0.25 (0.010)
N
N
S
SS
Frees
cale Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...

MPC962305DT-1H

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC CLOCK BUFFER 1:5 8-TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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