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PTN3332DH,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
PTN3332_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 14 August 2006 10 of 16
Philips Semiconductors
PTN3332
High speed differential line receiver
13. Package outline
Fig 7. Package outline SOT403-1 (TSSOP16)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.40
0.06
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1 MO-153
99-12-27
03-02-18
w M
b
p
D
Z
e
0.25
18
16
9
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
A
max.
1.1
pin 1 index
PTN3332_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 14 August 2006 11 of 16
Philips Semiconductors
PTN3332
High speed differential line receiver
Fig 8. Package outline SOT109-1 (SO16)
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1
99-12-27
03-02-19
076E07 MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
PTN3332_2 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 14 August 2006 12 of 16
Philips Semiconductors
PTN3332
High speed differential line receiver
14. Soldering
14.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215 °Cto260°C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
Table 9. SnPb eutectic process - package peak reflow temperatures (from
J-STD-020C
July 2004)
Package thickness Volume mm
3
< 350 Volume mm
3
≥ 350
< 2.5 mm 240 °C+0/−5 °C 225 °C+0/−5 °C
≥ 2.5 mm 225 °C+0/−5 °C 225 °C+0/−5 °C
Table 10. Pb-free process - package peak reflow temperatures (from
J-STD-020C
July
2004)
Package thickness Volume mm
3
< 350 Volume mm
3
350 to
2000
Volume mm
3
> 2000
< 1.6 mm 260 °C + 0 °C 260 °C + 0 °C 260 °C + 0 °C
1.6 mm to 2.5 mm 260 °C + 0 °C 250 °C + 0 °C 245 °C + 0 °C
≥ 2.5 mm 250 °C + 0 °C 245 °C + 0 °C 245 °C + 0 °C
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PTN3332DH,118

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Manufacturer:
NXP Semiconductors
Description:
IC DIFF LINE RCVR 16TSSOP
Lifecycle:
New from this manufacturer.
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