NTMFS4825NFET3G

© Semiconductor Components Industries, LLC, 2012
May, 2012 Rev. 1
1 Publication Order Number:
NTMFS4825NFE/D
NTMFS4825NFE
Power MOSFET
30 V, 171 A, Single NChannel, SO8 FL
Features
Low R
DS(on)
to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Includes Schottky Diode
Optimized Gate Charge to Minimize Switching Losses
Dual Sided Cooling Capability
These are PbFree Device
Applications
CPU Power Delivery
DCDC Converters
Low Side Switching
MAXIMUM RATINGS (T
J
= 25°C unless otherwise stated)
Parameter Symbol Value Unit
DraintoSource Voltage V
DSS
30 V
GatetoSource Voltage V
GS
±20 V
Continuous Drain
Current R
q
JA
(Note 1)
Steady
State
T
A
= 25°C
I
D
29
A
T
A
= 85°C 21
Power Dissipation
R
q
JA
(Note 1)
T
A
= 25°C P
D
2.74 W
Continuous Drain
Current R
q
JA
v
10 sec
T
A
= 25°C
I
D
47
A
T
A
= 85°C 34
Power Dissipation
R
q
JA,
t v 10 sec
T
A
= 25°C P
D
7.3 W
Continuous Drain
Current R
q
JA
(Note 2)
T
A
= 25°C
I
D
17
A
T
A
= 85°C 12
Power Dissipation
R
q
JA
(Note 2)
T
A
= 25°C P
D
0.95 W
Continuous Drain
Current R
q
JC
(Note 1)
T
C
= 25°C
I
D
171
A
T
C
= 85°C 123
Power Dissipation
R
q
JC
(Note 1)
T
C
= 25°C P
D
96.2 W
Pulsed Drain
Current
t
p
=10ms
T
A
= 25°C I
DM
288 A
Current limited by package T
A
= 25°C I
Dmaxpkg
100 A
Operating Junction and Storage
Temperature
T
J
,
T
STG
40 to
+150
°C
Source Current (Body Diode) I
S
120 A
Drain to Source dV/dt dV/dt 6 V/ns
Single Pulse DraintoSource Avalanche
Energy (V
DD
= 50 V, V
GS
= 10 V,
I
L
= 50 A
pk
, L = 0.3 mH, R
G
= 25 W)
EAS 375 mJ
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
SO8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
http://onsemi.com
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
825NFE
AYWZZ
1
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
30 V
2.0 mW @ 10 V
171 A
3.0 mW @ 4.5 V
G
S
NCHANNEL MOSFET
D
Device Package Shipping
ORDERING INFORMATION
NTMFS4825NFET1G SO8FL
(PbFree)
1500 /
Tape & Reel
NTMFS4825NFET3G SO8FL
(PbFree)
5000 /
Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
S
S
S
G
D
D
D
D
140 A
NTMFS4825NFE
http://onsemi.com
2
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
JunctiontoCase (Drain)
R
q
JC
1.3
°C/W
JunctiontoAmbient – Steady State (Note 1)
R
q
JA
45.7
JunctiontoAmbient – Steady State (Note 2)
R
q
JA
132.1
JunctiontoAmbient t v 10 sec
R
q
JA
17.2
JunctiontoTo p
R
q
JT
7.0
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 1.0 mA 30 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
28.5
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 24 V
T
J
= 25 °C 60 500
mA
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= ±20 V ±100 nA
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 1.0 mA 1.5 2.0 2.5 V
Negative Threshold Temperature Coefficient V
GS(TH)
/T
J
4 mV/°C
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V
I
D
= 22 A 1.3 2.0
mW
I
D
= 20 A 1.3
V
GS
= 4.5 V
I
D
= 20 A 2.0 3.0
I
D
= 18 A 2.0
Forward Transconductance g
FS
V
DS
= 15 V, I
D
= 15 A 90 S
CHARGES AND CAPACITANCES
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 15 V
5660
pF
Output Capacitance C
OSS
1150
Reverse Transfer Capacitance C
RSS
495
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 15 V; I
D
= 23 A
40.2
nC
Threshold Gate Charge Q
G(TH)
6.4
GatetoSource Charge Q
GS
15.3
GatetoDrain Charge Q
GD
13.4
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 15 V,
I
D
= 23 A
83.6
nC
SWITCHING CHARACTERISTICS (Note 4)
TurnOn Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DS
= 15 V,
I
D
= 15 A, R
G
= 3.0 W
26
ns
Rise Time t
r
24
TurnOff Delay Time t
d(OFF)
36
Fall Time t
f
13
3. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
4. Switching characteristics are independent of operating junction temperatures.
NTMFS4825NFE
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter UnitMaxTypMinTest ConditionSymbol
SWITCHING CHARACTERISTICS (Note 4)
TurnOn Delay Time
t
d(ON)
V
GS
= 10 V, V
DS
= 15 V,
I
D
= 15 A, R
G
= 3.0 W
15.7
ns
Rise Time t
r
21.2
TurnOff Delay Time t
d(OFF)
44.6
Fall Time t
f
14.5
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 2.0 A
T
J
= 25°C 0.35 0.70
V
T
J
= 125°C 0.26
Reverse Recovery Time t
RR
V
GS
= 0 V, dI
S
/dt = 100 A/ms,
I
S
= 23 A
39.1
ns
Charge Time t
a
20.1
Discharge Time t
b
19
Reverse Recovery Charge Q
RR
34 nC
PACKAGE PARASITIC VALUES
Source Inductance
L
S
T
A
= 25°C
0.66
nH
Drain Inductance L
D
0.20
Gate Inductance L
G
1.5
Gate Resistance R
G
0.7 2.0
W
3. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
4. Switching characteristics are independent of operating junction temperatures.

NTMFS4825NFET3G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET N-CH 30V 171A SO-8FL
Lifecycle:
New from this manufacturer.
Delivery:
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