GMM3X180-004X2-SMD

© 2011 IXYS All rights reserved
1 - 7
20110307b
GMM 3x180-004X2
IXYS reserves the right to change limits, test conditions and dimensions.
V
DSS
= 40 V
I
D25
= 180 A
R
DSon typ.
= 1.9 mW
Three phase full Bridge
with Trench MOSFETs
in DCB isolated high current package
Applications
AC drives
in automobiles
- electric power steering
- starter generator
in industrial vehicles
- propulsion drives
- fork lift drives
in battery supplied equipment
Features
MOSFETs in trench technology:
- low R
DSon
- optimized intrinsic reverse diode
package:
- high level of integration
- high current capability
- aux. terminals for MOSFET control
- terminals for soldering or welding
connections
- isolated DCB ceramic base plate
with optimized heat transfer
• Space and weight savings
MOSFETs
Symbol Conditions Maximum Ratings
V
DSS
T
VJ
= 25°C to 150°C 40 V
V
GS
±
20 V
I
D25
I
D90
I
D110
T
C
= 25°C
T
C
= 90°C
T
C
= 110°C
180
136
120
A
A
A
I
F25
I
F90
I
F110
T
C
= 25°C (diode)
T
C
= 90°C (diode)
T
C
= 110°C (diode)
182
112
88
A
A
A
S2
L3
G2
S1
G1
S3
G3
S4
G4
S5
G5
S6
G6
L3+
L2L1
L1+ L2+
L3-L1- L2-
Symbol Conditions Characteristic Values
(T
VJ
= 25°C, unless otherwise specified)
min. typ. max.
R
DSon
1)
on chip level at T
VJ
= 25°C
V
GS
= 10 V T
VJ
= 125°C
1.9
2.8
2.5
5.3
mW
mW
V
GS(th)
V
DS
= 20 V; I
D
= 1 mA 2.5 4.5 V
I
DSS
V
DS
= V
DSS
;
V
GS
= 0 V T
VJ
= 25°C
T
VJ
= 125°C 50
5 µA
µA
I
GSS
V
GS
=
±
20 V; V
DS
= 0 V 0.2 µA
Q
g
Q
gs
Q
gd
V
GS
= 10 V; V
DS
= 20 V; I
D
= 100 A
110
33
30
nC
nC
nC
t
d(on)
t
r
t
d(off)
t
f
inductive load
V
GS
= +10/0 V; V
DS
= 15 V
I
D
= 135 A; R
G
= 39 ;
T
J
= 125°C
150
240
350
170
ns
ns
ns
ns
E
on
E
off
E
recoff
0.12
0.51
0.003
mJ
mJ
mJ
R
thJC
R
thJH
with heat transfer paste (IXYS test setup) 1.3
1.0
1.6
K/W
K/W
1)
V
DS
= I
D
·(R
DS(on)
+ R
Pin to Chip
)
Preliminary data
p h a s e - o u t
Recommended replacement: MTI150WX40GD
© 2011 IXYS All rights reserved
2 - 7
20110307b
GMM 3x180-004X2
IXYS reserves the right to change limits, test conditions and dimensions.
Component
Symbol Conditions Maximum Ratings
I
RMS
per pin in main current paths (P+, N-, L1, L2, L3)
may be additionally limited by external connections
2 pins for output L1, L2, L3
75 A
T
J
T
stg
-55...+175
-55...+125
°C
°C
V
ISOL
I
ISOL
< 1 mA, 50/60 Hz, f = 1 minute 1000 V~
F
C
mounting force with clip 50 - 250 N
Symbol Conditions Characteristic Values
min. typ. max.
R
pin to chip
1)
L+ to L1/L2/L3 or L- to L1/L2/L3 0.9 mW
C
P
coupling capacity between shorted
pins and back side metallization
160
pF
Weight
25 g
1)
V
DS
= I
D
·(R
DS(on)
+ R
Pin to Chip
)
Source-Drain Diode
Symbol Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
V
SD
(diode) I
F
= 100 A; V
GS
= 0 V 0.9 1.2 V
t
rr
Q
RM
I
RM
I
F
= 100 A; -di
F
/dt = 600 A/µs
V
R
= 15 V; T
J
= 125°C
38
0.31
14
ns
µC
A
p h a s e - o u t
© 2011 IXYS All rights reserved
3 - 7
20110307b
GMM 3x180-004X2
IXYS reserves the right to change limits, test conditions and dimensions.
Leads Ordering
Part Name &
Packing Unit Marking
Part Marking Delivering Mode Base Qty.
Ordering
Code
SMD Standard GMM 3x180-004X2 - SMD GMM 3x180-004X2 Blister 28 509042
p h a s e - o u t

GMM3X180-004X2-SMD

Mfr. #:
Manufacturer:
Description:
MOSFET 3 Phase Full Bridge
Lifecycle:
New from this manufacturer.
Delivery:
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