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S4x Series
Sulfur Resistant Chip Resistor Arrays
DOC# 008-0546-0 Rev. A Page 4 of 6
Mechanical Specifications
Package Drawing – Convex, Type X Package Drawing – Concave, Type C
Notes
Package Configuration/Dimensions
Recommended Pad Layout
S40X043 0201 X 2 4 2 Isolated 0.85 ±0.05 0.60 ±0.05 0.50 0.35 ±0.05 N/A 0.11 ±0.05 0.17 ±0.05 0.37 ±0.05
S41X043 0402 X 2 4 2 Isolated
1.00 ±0.20 1.00 ±0.20 0.65 0.35 ±0.05 N/A 0.20 ±0.15 0.25 ±0.10 0.33 ±0.15
S41X083 0402 X 4 8 4 Isolated
2.00 ±0.20 1.00 ±0.15 0.50 0.35 ±0.10 0.30 ±0.15 0.20 ±0.15 0.20 ±0.15 0.40 ±0.15
S41C083 0402 X 4 8 4 Isolated
2.00 ±0.10 1.00 ±0.10 0.50 0.35 ±0.10 0.28 ±0.10 0.20 ±0.10 0.28 ±0.10 N/A
S42C043 0603 X 2 4 2 Isolated
1.60 ±0.15 1.60 ±0.15 0.80 0.45 ±0.10 N/A 0.35 ±0.15 0.40 ±0.15 0.50 ±0.15
S42X083 0603 X 4 8 4 Isolated
3.20 ±0.10 1.60 ±0.10 0.80 0.50 ±0.10 0.40 ±0.15 0.30 ±0.20 0.25 ±0.15 0.60 ±0.15
S42C083 0603 X 4 8 4 Isolated
3.20 ±0.15 1.60 ±0.15 0.80 0.45 ±0.10 0.50 ±0.15 0.35 ±0.15 0.40 ±0.15 N/A
S42C163 0603 X 8 16 8 Isolated
6.40 ±0.20 1.60 ±0.20 0.80 0.45 ±0.15 0.50 ±0.15 0.35 ±0.15 0.40 ±0.15 N/A
Resistor Size/
Configuration
1. JEDEC termination code (e3). Barrier-plating is nickel [Ni] with Matte tin [Sn] finish.
2. Reflow conditions per JEDEC J-STD-020; +260°C maximum, 20 seconds.
3. MSL = 1.
