BLM03HD102FN1D Datasheet BLM03HD152FN1D, BLM03HD601SN1D, BLM03HD471SN1D | P1-P3

Spec.No.JENF243A-0034H-01 P1/8

MURATA MFG.CO.,LTD.

Reference Onl

Chip Ferrite Bead BLM03H□□□□□N1□ Reference Specification

1.Scope

This reference specification applies to Chip Ferrite Bead BLM03H__N Series.

2.Part Numbering

(ex.) BL M 03 HG 601 S N 1 D

(1) (2) (3) (4) (5) (6) (7) (8) (9)

(1)Product ID (2)Type (3)Dimension(L×W) (4)Characteristics (5)Typical Impedance at 100MHz

(6)Performance(S:general/F:Low Rdc) (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)

3.Rating

Customer

Part Number

MURATA

Part Number

Impedance (Ω)

(Under Standard

Testing Condition)

Rated

Current

(mA)

DC Resistance

(Ω max.)

Remark

Initial

Values

After

Testing

at 100MHz at 1GHz

BLM03HG601SN1D

600±25% 1000±40% 150 1.6 1.7

For

general

use

BLM03HG601SN1B

BLM03HG102SN1D

1000±25% 1800±40% 125 2.6 2.7

BLM03HG102SN1B

BLM03HG122SN1D

1200±25% 2000±40% 100

3.5

3.6

BLM03HG122SN1B

BLM03HB191SN1D

190±25% 1150±40% 150 2.0 2.1

BLM03HB191SN1B

BLM03HB401SN1D

400±25％ 1850±40％

125 2.8 2.9

BLM03HB401SN1B

BLM03HD331SN1D

330±25% 750±40% 200 1.0 1.1

For

High speed

Signal line

BLM03HD331SN1B

BLM03HD471SN1D

470±25% 1000±40% 175 1.3 1.4

BLM03HD471SN1B

BLM03HD601SN1D

600±25% 1500±40% 150 1.7 1.8

BLM03HD601SN1B

BLM03HD102SN1D

1000±25%

2300±40%

120 2.9 3.0

BLM03HD102SN1B

BLM03HD102FN1D

1000±25% 2300±40% 135 2.4 2.5

BLM03HD102FN1B

BLM03HD152FN1D

1500±25% 2700±40% 120 3.1 3.2

BLM03HD152FN1B

BLM03HD182FN1D

1800±25%

3000±40%

100 3.8 3.9

BLM03HD182FN1B

■Operating Temperature : -55°C to +125°C ■Storage Temperature : -55°C to +125°C

4.Style and Dimensions

■ Equivalent Circuit

■ Unit Mass(Typical value)

(in mm) 0.0003g

5.Marking

No marking.

: Electrode

0.6±0.03

0.3±0.03

0.15±0.05

0.3±0.03

Resistance element becomes

dominant at high frequencies.

()

Spec.No.JENF243A-0034H-01 P2/8

MURATA MFG.CO.,LTD.

Reference Onl

6.Standard Testing Conditions

< Unless otherwise specified > < In case of doubt >

Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C

Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)

Atmospheric pressure : 86kPa to 106kPa

7.Specifications

7-1.Electrical Performance

No. Item Specification Test Method

7-1-1 Impedance Meet item 3.

Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz

Measuring Equipment : KEYSIGHT 4991A or the

equivalent

Test Fixture : KEYSIGHT 16197A or the equivalent

7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter

*Except resistance of the Substrate and Wire

7-2.Mechanical Performance

No. Item Specification Test Method

7-2-1 Appearance and

Dimensions

Meet item 4. Visual Inspection and measured with Measuring

Microscope.

7-2-2 Bending

Strength

Meet Table 1.

Table 1

It shall be soldered on the Glass-epoxy substrate.

Substrate : 100mm×40mm×0.8mm

Deflection : 1.0mm

Speed of Applying Force : 0.5mm/s

Keeping Time : 30s

7-2-3 Vibration

It shall be soldered on the substrate.

Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20 min

Total Amplitude 1.5mm or Acceleration 196m/s

whichever is smaller

Testing Time : A period of 2 hours in each of 3 mutually

perpendicular directions. (Total 6 h)

7-2-4 Resistance

to Soldering

Heat

Pre-Heating : 150°C±10°C, 60s～90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270°C±5°C

Immersion Time : 10s±0.5s

Immersion and emersion rates : 25mm/s

Then measured after exposure in the room condition

for 48h±4h.

7-2-5 Solderability The electrodes shall be at

least 95% covered with new

solder coating.

Flux : Ethanol solution of rosin,25(wt)%

Pre-Heating : 150°C±10°C, 60s～90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 240°C±5°C

Immersion Time : 3s±1s

Immersion and emersion rates : 25mm/s

Appearance No damage

Impedance

Change

(at 100MHz)

Within ±30%

Resistance

Meet item 3.

45mm

R340

Deflection

45mm

Product

Pressure jig

Spec.No.JENF243A-0034H-01 P3/8

MURATA MFG.CO.,LTD.

Reference Onl

0.55max.

0.36

(Typ.)

0.66

(Typ.)

4.0±0.1

1.5

+0.1

-0

1.75±0.1

8.0±0.3

Direction of Feed

3.5±0.05

2.0±0.05

7-3.Environmental Performance

It shall be soldered on the substrate.

No. Item Specification Test Method

7-3-1 Temperature

Cycle

Meet Table 1. 1 cycle :

1 step : -55 °C(+0 °C,-3 °C) / 30min±3min

2 step : Ordinary temp. / 10min to 15min

3 step : +125 °C(+3 °C,-0 °C) / 30min±3min

4 step : Ordinary temp. / 10min to 15min

Total of 100 cycles

Then measured after exposure in the room condition for 48h±4h.

7-3-2 Humidity Temperature : 70°C±2°C

Humidity : 90%RH to 95%RH

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for 48h±4h.

7-3-3 Heat Life Temperature : 125°C±3°C

Applying Current : Rated Current

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for 48h±4h.

7-3-4 Cold Resistance Temperature : -55±2°C

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for 48h±4h.

8.Specification of Packaging

8-1.Appearance and Dimensions

(8mm-wide paper tape)

(in mm)

(1)Taping

Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously

and sealed by cover tape .

(2)Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.

(3)Spliced point:The base tape and cover tape have no spliced point

(4)Cavity:There shall not be burr in the cavity.

(5)Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,

and are not continuous. The specified quantity per reel is kept.

8-2.Tape Strength

(1)Pull Strength

Cover tape

5N min.

(2)Peeling off force of Cover tape

0.1N to 0.6N (Minimum value is typical.)

*Speed of Peeling off:300mm/min

165 to 180 degree

Cover tape

Base tape

P1-P3 P4-P6 P7-P8

BLM03HD102FN1D

Mfr. #:

Buy BLM03HD102FN1D

Manufacturer:

Murata Electronics

Description:

Ferrite Beads 0201 1.0Kohm 135.0mA DCR = 2.4ohms

Lifecycle:

New from this manufacturer.

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BLM03HD102FN1D

BLM03HD102FN1D

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