HSE-B20630-040H-01

date 05/02/2017
page
1 of 5
cui.com
SERIES: HSE-B20X-01 DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• slide in style
• multiple available cut lengths
MODEL
thermal resistance
1
power
dissipation
1
length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSE-B20250-040H-01 25 13.64 18.58 4.44 3.30 5.50
HSE-B20380-040H-01 38 10.27 13.31 5.77 3.68 7.30
HSE-B20500-040H-01 50 8.43 11.67 2.85 1.91 8.90
HSE-B20630-040H-01 63 8.24 11.01 4.46 2.97 9.10
Note: 1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
012345
Dissipated Power (W)
6789
10
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 18.58 4.44 3.30
2 33.32 9.59 6.21
3 45.87 14.21 9.38
4 58.26 18.79 12.55
5 69.68 23.71 15.95
6 82.14 28.49 19.39
7 92.93 32.90 22.71
8 102.15 37.44 25.85
9 110.43 42.50 29.39
10 117.47 47.13 32.50
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20250-040H-01
For more information, please visit the product page.
cui.com
CUI Inc SERIES: HSE-B20X-01 DESCRIPTION: HEAT SINK date 05/02/2017 page 2 of 5
PERFORMANCE CURVES (CONTINUED)
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
012345
Dissipated Power (W)
6789
10
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 13.31 5.77 3.68
2 23.81 11.53 7.60
3 35.45 17.15 11.49
4 46.08 22.72 15.29
5 55.96 28.33 19.24
6 64.57 33.55 22.98
7 73.20 38.93 26.79
8 81.80 44.23 30.63
9 89.50 50.00 34.54
10 97.33 55.53 38.67
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20380-040H-01
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
012345
Dissipated Power (W)
6789
10
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 11.67 2.85 1.91
2 22.26 5.68 4.07
3 31.61 8.58 6.11
4 40.44 11.07 8.18
5 49.31 14.07 10.26
6 57.03 16.67 12.51
7 62.88 19.49 14.23
8 69.61 22.33 16.13
9 76.25 25.14 18.16
10 83.27 28.02 20.35
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20500-040H-01
For more information, please visit the product page.
cui.com
CUI Inc SERIES: HSE-B20X-01 DESCRIPTION: HEAT SINK date 05/02/2017 page 3 of 5
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
012345
Dissipated Power (W)
6 789
10
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 11.01 4.46 2.97
2 20.23 8.99 6.12
3 29.76 13.50 9.20
4 37.54 18.04 12.16
5 45.62 22.74 15.31
6 52.89 27.33 18.44
7 59.78 31.53 21.42
8 67.39 35.77 24.49
9 74.31 40.18 27.56
10 80.97 44.35 30.69
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20630-040H-01
PERFORMANCE CURVES (CONTINUED)
For more information, please visit the product page.

HSE-B20630-040H-01

Mfr. #:
Manufacturer:
CUI Inc
Description:
Heat Sinks 63x29x12.5mm w/pin extrusion TO-220
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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