(All voltages referenced to GND)
V
DD
........................................................................-0.3V to +40V
M1, M2 ....................................................... -0.3V to (V
DD
+0.3V)
PWM, DIR, FAULT, EN, SNS, VREF,
MODE, TCOFF
...............................................................
-0.3V to +6.0V
COM .....................................................................-0.3V to +0.3V
Current Into M1, M2 .............................................................±3A
Continuous Power Dissipation (T
A
= +70°C)
Single-Layer Board (derate at 21.3mW/°C
above +70°C) ............................................................1702mW
Multiple-Layer Board (derate at 26.1mW/°C
above +70°C) ............................................................2088mW
Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ...................................................... +150ºC
Storage Temperature Range .............................-65ºC to +150°C
Lead Temperature (Soldering, 10s) ................................+300°C
Solder Temperature (Reflow) .........................................+260°C
Junction-to-Case Thermal Resistance (θ
JC
)
TSSOP-EP (Single-Layer Board) ..................................3°C/W
TSSOP-EP (Multiple-Layer Board) ................................3°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
)
TSSOP-EP (Single-Layer Board) ................................47°C/W
TSSOP-EP (Multiple-Layer Board) ...........................38.3°C/W
(Note 1)
(V
DD
= 4.5V to 36V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
DD
= 12V, T
A
= +25°C)(Note 3)
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage V
DD
4.5 36 V
Supply Current I
DD
EN = low, M1/M2
not connected
f
PWM
= 50kHz 1
mA
No switching 0.5 1.2
Shutdown Supply Current I
SHDN
EN = high, Driver
is in shutdown
V
DD
= 12V 3.7 10
μA
V
DD
= 36V 10 20
Undervoltage Lockout
Threshold
V
UVLO
V
DD
rising 3.3 3.8 4.3 V
Undervoltage Lockout
Threshold Hysteresis
V
UVLO_HYST
400 mV
DRIVER (M1, M2)
Driver Output Resistance
(High-Side + Low-Side)
R
ON
I
M_
= 2.8A
T
J
= 25°C 334 435
mΩ
T
J
= 125°C 465 620
Driver Overload Current Limit I
M_OL
3 A
M1, M2 Leakage Current I
M_LKG
EN = High, V
M1
= V
M2
= 0V or V
DD
-1 +1 μA
M1, M2 Body Diode Forward-
Voltage
V
BF
Low-side diode, EN = High, I
F
= 2.8A 1.5
V
High-side diode, EN = High, I
F
= 2.8A 1.5
MAX14871 4.5V to 36V Full-Bridge DC Motor Driver
www.maximintegrated.com
Maxim Integrated
│
2
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics
