V
DD
to GND ............................................................-0.3V to +4V
SDA, SCL to GND ...................................................-0.3V to +4V
Continuous Power Dissipation (Multilayer Board,
T
A
= +70°C, derate 9.7mW/°C above +70°C) .............776mW
Operating Temperature Range ......................... -20°C to +150°C
Storage Temperature Range ............................ -60°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
ULTRA-THIN WLP
PACKAGE CODE Z40C0+1
Outline Number 21-100151
Land Pattern Number See App Note 1891
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
) 103
Junction to Case (θ
JC
) NA
(T
A
= -20°C to +125°C, V
DD
= 1.6V to 3.6V, resolution = 10 bits, unless otherwise specified. Limits are 100% tested at T
A
= 25°C. Limits
over the operating temperature range and relevant supply voltage range are guaranteed by design and characterization.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Temperature
Measurement Error
V
DD
= 3.3V
+10°C ≤ T
A
≤ +45°C,
resolution = 12 bits
-1.5 ±0.5 +1.5 °C
V
DD
= 3.3V
-10°C ≤ T
A
≤ +100°C -2 ±0.6 +2 °C
-20°C ≤ T
A
≤ +125°C -3 ±1 +3
°C
-20°C ≤ T
A
≤ +150°C ±2
Temperature
Resolution
Selected by Resolution bits D6:D5 in
Conguration register. 8-bit (00)
1.0 °C
Selected by Resolution bits D6:D5 in
Conguration register. 9-bit (01)
0.5
°C
Selected by Resolution bits D6:D5 in
Conguration register. 10-bit (10)
0.25
Selected by Resolution bits D6:D5 in
Conguration register. 12-bit (11)
0.0625
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information
Electrical Characteristics
www.maximintegrated.com
Maxim Integrated
│
2
MAX31875 Low-Power I
2
C Temperature
Sensor in WLP Package
