LTC2436-1
4
24361f
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
CC
Supply Voltage 2.7 5.5 V
I
CC
Supply Current
Conversion Mode CS = 0V (Note 14)
200 300 µA
Sleep Mode CS = V
CC
(Notes 11, 14) 413 µA
Sleep Mode CS = V
CC
, 2.7V V
CC
3.3V 2 µA
(Notes 11, 14)
The denotes specifications which apply over the full operating temperature range,
otherwise specifications are at T
A
= 25°C. (Note 3)
The denotes specifications which apply over the full
operating temperature range, otherwise specifications are at T
A
= 25°C. (Note 3)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IH
High Level Input Voltage 2.7V V
CC
5.5V 2.5 V
CS, F
O
2.7V V
CC
3.3V 2.0 V
V
IL
Low Level Input Voltage 4.5V V
CC
5.5V 0.8 V
CS, F
O
2.7V V
CC
5.5V 0.6 V
V
IH
High Level Input Voltage 2.7V V
CC
5.5V (Note 8) 2.5 V
SCK 2.7V V
CC
3.3V (Note 8) 2.0 V
V
IL
Low Level Input Voltage 4.5V V
CC
5.5V (Note 8) 0.8 V
SCK 2.7V V
CC
5.5V (Note 8) 0.6 V
I
IN
Digital Input Current 0V V
IN
V
CC
–10 10 µA
CS, F
O
I
IN
Digital Input Current 0V V
IN
V
CC
(Note 8) –10 10 µA
SCK
C
IN
Digital Input Capacitance 10 pF
CS, F
O
C
IN
Digital Input Capacitance (Note 8) 10 pF
SCK
V
OH
High Level Output Voltage I
O
= –800µA V
CC
– 0.5 V
SDO
V
OL
Low Level Output Voltage I
O
= 1.6mA 0.4 V
SDO
V
OH
High Level Output Voltage I
O
= –800µA (Note 9) V
CC
– 0.5 V
SCK
V
OL
Low Level Output Voltage I
O
= 1.6mA (Note 9) 0.4 V
SCK
I
OZ
Hi-Z Output Leakage –10 10 µA
SDO
DIGITAL I PUTS A D DIGITAL OUTPUTS
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POWER REQUIRE E TS
WU
LTC2436-1
5
24361f
Note 1: Absolute Maximum Ratings are those values beyond which the
life of the device may be impaired.
Note 2: All voltage values are with respect to GND.
Note 3: V
CC
= 2.7V to 5.5V unless otherwise specified.
V
REF
= REF
+
– REF
, V
REFCM
= (REF
+
+ REF
)/2; V
IN
= IN
+
– IN
,
V
INCM
= (IN
+
+ IN
)/2, IN
+
and IN
are defined as the selected positive
(CH0
+
or CH1
+
) and negative (CH0
or CH1
) input respectively.
Note 4: F
O
pin tied to GND or to an external conversion clock source
with f
EOSC
= 139,800Hz unless otherwise specified.
Note 5: Guaranteed by design, not subject to test.
Note 6: Integral nonlinearity is defined as the deviation of a code from
a precise analog input voltage. Maximum specifications are limited by
the LSB step size (V
REF
/2
16
) and the single shot measurement. Typical
specifications are measured from the center of the quantization band.
Note 7: F
O
= GND (internal oscillator) or f
EOSC
= 139,800Hz ±2%
(external oscillator).
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
f
EOSC
External Oscillator Frequency Range 2.56 2000 kHz
t
HEO
External Oscillator High Period 0.25 390 µs
t
LEO
External Oscillator Low Period 0.25 390 µs
t
CONV
Conversion Time F
O
= 0V 143.8 146.7 149.6 ms
External Oscillator (Note 10)
20510/f
EOSC
(in kHz) ms
f
ISCK
Internal SCK Frequency Internal Oscillator (Note 9) 17.5 kHz
External Oscillator (Notes 9, 10) f
EOSC
/8 kHz
D
ISCK
Internal SCK Duty Cycle (Note 9) 45 55 %
f
ESCK
External SCK Frequency Range (Note 8) 2000 kHz
t
LESCK
External SCK Low Period (Note 8) 250 ns
t
HESCK
External SCK High Period (Note 8) 250 ns
t
DOUT_ISCK
Internal SCK 19-Bit Data Output Time Internal Oscillator (Notes 9, 11) 1.06 1.09 1.11 ms
External Oscillator (Notes 9, 10)
152/f
EOSC
(in kHz) ms
t
DOUT_ESCK
External SCK 19-Bit Data Output Time (Note 8) 19/f
ESCK
(in kHz) ms
t
1
CS to SDO Low Z 0 200 ns
t2 CS to SDO High Z 0 200 ns
t3 CS to SCK (Note 9) 0 200 ns
t4 CS to SCK (Note 8) 50 ns
t
KQMAX
SCK to SDO Valid 220 ns
t
KQMIN
SDO Hold After SCK (Note 5) 15 ns
t
5
SCK Set-Up Before CS 50 ns
t
6
SCK Hold After CS 50 ns
The denotes specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25°C. (Note 3)
Note 8: The converter is in external SCK mode of operation such that
the SCK pin is used as digital input. The frequency of the clock signal
driving SCK during the data output is f
ESCK
and is expressed in kHz.
Note 9: The converter is in internal SCK mode of operation such that
the SCK pin is used as digital output. In this mode of operation the
SCK pin has a total equivalent load capacitance C
LOAD
= 20pF.
Note 10: The external oscillator is connected to the F
O
pin. The external
oscillator frequency, f
EOSC
, is expressed in kHz.
Note 11: The converter uses the internal oscillator.
F
O
= 0V.
Note 12: 800nV RMS noise is independent of V
REF
. Since the noise
performance is limited by the quantization, lowering V
REF
improves the
effective resolution.
Note 13: Guaranteed by design and test correlation.
Note 14: The low sleep mode current is valid only when CS is high.
TI I G CHARACTERISTICS
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LTC2436-1
6
24361f
V
CC
(Pin 1): Positive Supply Voltage. Bypass to GND with
a 10µF tantalum capacitor in parallel with 0.1µF ceramic
capacitor as close to the part as possible.
REF
+
(Pin 2), REF
(Pin 3): Differential Reference Input.
The voltage on these pins can have any value between GND
and V
CC
as long as the reference positive input, REF
+
, is
maintained more positive than the reference negative
input, REF
, by at least 0.1V.
CH0
+
(Pin 4): Positive Input for Differential Channel 0.
CH0
(Pin 5): Negative Input for Differential Channel 0.
CH1
+
(Pin 6): Positive Input for Differential Channel 1.
CH1
(Pin 7): Negative Input for Differential Channel 1.
The voltage on these four analog inputs (Pins 4 to 7) can
have any value between GND and V
CC
. Within these limits
the converter bipolar input range (V
IN
= IN
+
– IN
) extends
from –0.5 • (V
REF
) to 0.5 • (V
REF
). Outside this input range
the converter produces unique overrange and underrange
output codes.
GND (Pins 8, 9, 10, 15, 16): Ground. Multiple ground pins
internally connected for optimum ground current flow and
V
CC
decoupling. Connect each one of these pins to a ground
plane through a low impedance connection. All five pins must
be connected to ground for proper operation.
CS (Pin 11): Active LOW Digital Input. A LOW on this pin
enables the SDO digital output and wakes up the ADC.
Following each conversion the ADC automatically enters
the Sleep mode and remains in this low power state as
long as CS is HIGH. A LOW-to-HIGH transition on CS
during the Data Output transfer aborts the data transfer
and starts a new conversion.
SDO (Pin 12): Three-State Digital Output. During the Data
Output period, this pin is used as serial data output. When
the chip select CS is HIGH (CS = V
CC
) the SDO pin is in a
high impedance state. During the Conversion and Sleep
periods, this pin is used as the conversion status output.
The conversion status can be observed by pulling CS LOW.
SCK (Pin 13): Bidirectional Digital Clock Pin. In Internal
Serial Clock Operation mode, SCK is used as digital output
for the internal serial interface clock during the Data
Output period. In External Serial Clock Operation mode,
SCK is used as digital input for the external serial interface
clock during the Data Output period. A weak internal pull-
up is automatically activated in Internal Serial Clock Op-
eration mode. The Serial Clock Operation mode is deter-
mined by the logic level applied to the SCK pin at power up
or during the most recent falling edge of CS.
F
O
(Pin 14): Frequency Control Pin. Digital input that
controls the ADC’s notch frequencies and conversion
time. When the F
O
pin is connected to GND (F
O
= 0V), the
converter uses its internal oscillator and rejects 50Hz and
60Hz simultaneously. When F
O
is driven by an external
clock signal with a frequency f
EOSC
, the converter uses this
signal as its system clock and the digital filter has 87dB
minimum rejection in the range f
EOSC
/2560 ±14% and
110dB minimum rejection at f
EOSC
/2560 ±4%.
UU
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PI FU CTIO S

LTC2436-1CGN#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 2-Ch Diff In 16-B No Lat DS ADC
Lifecycle:
New from this manufacturer.
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