CM200DU-24NFH

Feb. 2009
CM200DU-24NFH
APPLICATION
High frequency switching use (30kHz to 60kHz).
Gradient amplifier, Induction heating, power supply, etc.
MITSUBISHI IGBT MODULES
CM200DU-24NFH
HIGH POWER SWITCHING USE
¡IC ...................................................................200A
¡V
CES ......................................................... 1200V
¡Insulated Type
¡2-elements in a pack
OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm
8.85
(8.25)
(18)
CIRCUIT DIAGRAM
C2E1
E2
C1
G2E2
E1
G1
4
0.5
0.5
25.7
0.5
0.5
E1
E2
G2
G1
CM
C1
E2
C2E1
LABEL
4-φ6. 5 MOUNTING HOLES
3-M6 NUTS
108
29
+1.0
–0.5
62
18 7 18 7 18
8.5
22
93
±0.25
48
±0.25
2.8
4
7.5
6156
(7)
17.5
14 14 14
25 2.521.525
TC measured point
(7.5)(7.5)
Feb. 2009
2
Gate-emitter threshold voltage
Thermal resistance
*1
Collector-emitter voltage
Gate-emitter voltage
Maximum collector dissipation
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
Weight
VCE = VCES, VGE = 0V
±V
GE = VGES, VCE = 0V
T
j = 25°C
T
j = 125°C
V
CC = 600V, IC = 200A, VGE = 15V
V
CC = 600V, IC = 200A
V
GE = ±15V
R
G = 1.6, Inductive load
I
E = 200A
I
E = 200A, VGE = 0V
IGBT part (1/2 module)
FWDi part (1/2 module)
Case to heat sink, Thermal compound Applied
*2
(1/2 module)
IGBT part (1/2 module)
FWDi part (1/2 module)
I
C = 20mA, VCE = 10V
I
C = 200A, VGE = 15V
V
CE = 10V
V
GE = 0V
1200
±20
200
400
200
400
830
1300
–40 ~ +150
–40 ~ +125
2500
3.5 ~ 4.5
3.5 ~ 4.5
400
MITSUBISHI IGBT MODULES
CM200DU-24NFH
HIGH POWER SWITCHING USE
V
V
A
A
A
A
W
W
°C
°C
Vrms
N • m
N • m
g
1
0.7
6.5
32
2.7
0.6
300
80
500
150
250
3.5
0.15
0.24
0.095
*3
0.14
*3
16
mA
µA
nF
nF
nF
nC
ns
ns
ns
ns
µC
V
K/W
K/W
K/W
K/W
K/W
5.0
5.0
900
7.5
0.04
1.6
6V
V
4.5 7.5
ns
Collector cutoff current
Gate leakage current
Collector-emitter saturation voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Contact thermal resistance
Thermal resistance
*4
External gate resistance
I
CES
IGES
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (
Note 1
)
Qrr (
Note 1
)
VEC(
Note 1
)
Rth(j-c)Q
R
th(j-c)R
R
th(c-f)
Rth(j-c’)Q
R
th(j-c’)R
R
G
Symbol
Parameter
V
GE(th)
VCE(sat)
*
1 : Case temperature (TC) measured point is shown in page OUTLINE DRAWING.
*
2 : Typical value is measured by using thermally conductive grease of
λ
= 0.9[W/(m • K)].
*
3 : If you use this value, Rth(f-a) should be measured just under the chips.
*
4 : Case temperature (TC’) measured point is just under the chips.
Note 1. I
E, IEM, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter-collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (T
j) does not exceed Tjmax rating.
3. Junction temperature (T
j) should not increase beyond 150°C.
4. No short circuit capability is designed.
G-E Short
C-E Short
Operation (Note 2)
Pulse (Note 2)
Operation (Note 2)
Pulse (Note 2)
T
C = 25°C
T
C’ = 25°C
*4
Terminals to base plate, f = 60Hz, AC 1 minute
Main terminals M6 screw
Mounting M6 screw
Typical value
Symbol Parameter
Collector current
Emitter current
Mounting torque
Conditions UnitRatings
V
CES
VGES
IC
ICM
IE (
Note 1
)
IEM (
Note 1
)
PC (
Note 3
)
PC (
Note 3
)
Tj
Tstg
Viso
Unit
Typ.
Limits
Min. Max.
Test conditions
MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Feb. 2009
3
MITSUBISHI IGBT MODULES
CM200DU-24NFH
HIGH POWER SWITCHING USE
10
–1
10
0
10
1
10
2
2
3
5
7
2
3
5
7
2
3
5
7
14
10
–1
2
10
0
357 2
10
1
357 2
10
2
357
V
GE
= 0V
C
ies
C
oes
C
res
0 5101520
V
CE
= 10V
0
1
6
7
8
9
2
3
4
5
050100 150 200 350 400250 300
T
j
= 25°C
T
j
= 125°C
V
GE
= 15V
0
50
100
150
200
250
300
350
400
0246810
0
50
100
150
200
250
300
350
400
V
GE
=20
(V)
T
j
= 25°C
12
9
8
11
10
13
0
2
4
6
8
10
61014188121620
T
j
= 25°C
I
C
= 400A
I
C
= 200A
I
C
= 80A
10
1
10
2
2
3
5
7
012 435
10
3
2
3
5
7
T
j
= 25°C
T
j
= 125°C
15
T
j
= 25°C
T
j
= 125°C
FREE-WHEEL DIODE
FORWARD CHARACTERISTICS
(
TYPICAL
)
EMITTER CURRENT I
E
(
A
)
EMITTER-COLLECTOR VOLTAGE V
EC
(
V
)
CAPACITANCE CHARACTERISTICS
(
TYPICAL
)
CAPACITANCE C
ies
, C
oes
, C
res
(
nF
)
COLLECTOR-EMITTER VOLTAGE V
CE
(
V
)
OUTPUT CHARACTERISTICS
(
TYPICAL
)
COLLECTOR CURRENT I
C
(
A
)
TRANSFER CHARACTERISTICS
(
TYPICAL
)
COLLECTOR CURRENT I
C
(
A
)
GATE-EMITTER VOLTAGE V
GE
(
V
)
COLLECTOR-EMITTER
SATURATION VOLTAGE V
CE(sat)
(
V
)
COLLECTOR CURRENT I
C
(
A
)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(
TYPICAL
)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(
TYPICAL
)
COLLECTOR-EMITTER VOLTAGE V
CE
(
V
)
COLLECTOR-EMITTER
SATURATION VOLTAGE V
CE(sat)
(
V
)
GATE-EMITTER VOLTAGE V
GE
(
V
)
PERFORMANCE CURVES

CM200DU-24NFH

Mfr. #:
Manufacturer:
Description:
IGBT MOD DUAL 1200V 200A NFH SER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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