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2SK3431-Z-E1-AZ
P1-P3
P4-P6
P7-P9
P10-P10
Data Sheet D14600EJ3V
0DS
5
2SK3431
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
T
ch
- Channel Temperature -
˚
C
R
DS(on)
- Drain to Source On-state Resistance - m
Ω
0
−
50
2
4
6
0
50
100
150
I
D
= 42 A
8
10
12
Pulsed
V
GS
= 4 V
V
GS
= 10 V
SOURCE TO DRAIN DIODE
FORWARD VOLTAGE
1.0
I
SD
- Diode Forward Current - A
0
1.5
V
SD
- Source to Drain Voltage - V
0.5
Pulsed
0.1
1
10
100
1000
V
GS
= 10 V
V
GS
= 0 V
CAPACITANCE vs. DRAIN TO
SOURCE VOLTAGE
V
DS
- Drain to Source Voltage - V
C
iss
, C
oss
, C
rss
- Capacitance - pF
100
0.1
1000
10000
100000
1
10
100
V
GS
= 0 V
f = 1 MHz
C
oss
C
rss
C
iss
SWITCHING CHARACTERISTICS
I
D
- Drain Current - A
t
d(on)
, t
r
, t
d(off)
, t
f
- Switching Time - ns
100
10
1
0.1
1000
10000
10
100
t
f
t
r
t
d(on)
t
d(off)
REVERSE RECOVERY TIME vs.
DRAIN CURRENT
I
D
- Drain Current - A
t
rr
- Reverse Recovery Time - ns
di/dt = 100 A/ s
V
GS
= 0 V
1
0.1
10
1.0
10
100
1000
100
µ
DYNAMIC INPUT/OUTPUT CHARACTERISTICS
V
GS
- Gate to Source Voltage - V
Q
G
- Gate Charge - nC
V
DS
- Drain to Source Voltage - V
0
0
40
60
20
80
100
120
140
160
10
20
30
40
50
60
70
80
2
4
6
8
10
12
14
16
V
GS
V
DD
= 32 V
20 V
8 V
V
DS
Data Sheet D14600EJ3V
0DS
6
2SK3431
SINGLE AVALANCHE CURRENT vs.
INDUCTIVE LOAD
L - Inductive Load - H
I
AS
- Single Avalanche Current - A
10
100
1000
1
m1
0
m
V
DD
= 20
V
R
G
= 25
Ω
V
GS
= 20
→
0
V
I
AS
= 65
A
10
µ
100
µ
1
E
A
S
= 423 mJ
SINGLE AVALANCHE ENERGY
DERATING FACTOR
Energy Derating Factor - %
25
50
75
100
160
140
120
100
80
60
40
20
0
125
150
Starting T
ch
- Starting Channel Temperature - ˚C
V
DD
= 20 V
R
G
= 25
Ω
V
GS
= 20
→
0
V
I
AS
≤
65 A
Data Sheet D14600EJ3V
0DS
7
2SK3431
PA
CKAGE DRA
WINGS (Unit: mm)
1) TO-220AB
(MP-25)
4.8 MAX.
1.Gate
2.Drain
3.Source
4.Fin (Drain)
1
2
3
10.6 MAX.
10.0 TYP.
3.6±0.2
4
3.0±0.3
1.3±0.2
0.75±0.1
2.54 TYP.
2.54 TYP.
5.9 MIN.
6.0 MAX.
15.5 MAX.
12.7 MIN.
1.3±0.2
0.5±0.2
2.8±0.2
φ
2)
TO-262 (MP-25 Fin Cut)
4.8 MAX.
1.Gate
2.Drain
3.Source
4.Fin (Drain)
1
2
3
10 TYP.
1.3±0.2
0.75±0.3
2.54 TYP.
2.54 TYP.
8.5±0.2
12.7 MIN.
1.3±0.2
0.5±0.2
2.8±0.2
1.0±0.
5
4
3) TO-263
(MP-25ZJ)
1.4±0.2
1.0±0.5
2.54 TYP.
2.54 TYP.
8.5±0.2
123
5.7±0.4
4
4.8 MAX.
1.3±0.2
0.5±0.2
1.Gate
2.Drain
3.Source
4.Fin (Drain)
0.7±0.2
10 TYP.
0.5R TYP.
0.8R TYP.
2.8±0.2
4) TO-220SMD (MP-25Z)
Note
10 TYP.
1.4±0.2
1.0±0.5
2.54 TYP.
2.54 TYP.
8.5±0.2
123
3.0±0.5
1.1±0.4
4
4.8 MAX.
1.3±0.2
0.5±0.2
0.5R TYP.
0.8R TYP.
0.75±0.3
2.8±0.2
1.Gate
2.Drain
3.Source
4.Fin (Drain)
Note
This package is produced only in Japan.
Source
Body
Diode
Gate
Protection
Diode
Gate
Drain
Remark
T
he diode connected between the gate and source of the transistor
serves as
a protector against ESD. W
hen this device actually used,
an additional protection
circuit is externally
required if a voltage
exceeding the rated v
oltage may be applied to this device.
EQUIVA
LENT
CIRCUIT
★
P1-P3
P4-P6
P7-P9
P10-P10
2SK3431-Z-E1-AZ
Mfr. #:
Buy 2SK3431-Z-E1-AZ
Manufacturer:
Renesas Electronics
Description:
MOSFET MOSFET
Lifecycle:
New from this manufacturer.
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