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AD8156ABCZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
AD8156
Rev. 0 | Page 6 of 20
CS
UPD
WE
OUTxN/P
ENABLE
OUTxN/P
DISABLE
OUTxN/P
TOGGLE
t
WOE
t
WOD
t
WOT
t
WHU
06305-004
Figure 4. Transparent Write and Update Cycle
DATA[3:0]
ADDR[3:0]
ADDR1 ADDR2
DATA2DATA1
RE
CS
t
CSR
t
RDE
t
AA
t
RHA
t
CHR
t
RDD
06305-005
Figure 5. Second Rank Readback Cycle
t
TOD
t
TW
OUTxN/P
DISABLE
RST
06305-006
Figure 6. Asynchronous Reset
AD8156
Rev. 0 | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
V
CC
to V
EE
3.6 V
V
TTI
V
CC
+ 0.6 V
V
TTO
V
CC
+ 0.6 V
Internal Power Dissipation
1
1.92 W
Input Voltage V
CC
+ 0.6 V
Logic Input Voltage V
EE
− 0.3 V < V
IN
< V
CC
+ 0.6 V
Storage Temperature Range −65°C to +125°C
Junction Temperature 150°C
Lead Temperature Range 300°C
1
Specification for T
A
= 25°C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
49-Ball CSP_BGA 65 28 °C/W
ESD CAUTION
AD8156
Rev. 0 | Page 8 of 20
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
A
B
C
D
E
F
G
7654321
06305-007
V
EE
IN1NIN1PV
TTI
IN0NIN0PV
CC
IN2PV
EE
D3V
EE
MODEV
CC
OUT0P
IN2ND0D2RSTWECSOUT0N
V
TTI
V
EE
D1V
EE
UPDV
CC
V
TTO
IN3PA0A1A3REV
CC
OUT1P
IN3NV
CC
A2V
EE
V
EE
V
EE
OUT1N
V
CC
OUT3NOUT3PV
TTO
OUT2NOUT2PV
EE
Figure 7. Pin Configuration (Bottom View)
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
A1 V
EE
Negative Supply.
A2 IN1N High Speed Input Complement.
A3 IN1P High Speed Input.
A4 V
TTI
Input Termination Supply.
A5 IN0N High Speed Input Complement.
A6 IN0P High Speed Input.
A7 V
CC
Positive Supply.
B1 IN2P High Speed Input.
B2 V
EE
Negative Supply.
B3 D3 Input Address Pin (MSB).
B4 V
EE
Negative Supply.
B5 MODE Mode Select Pin.
B6 V
CC
Positive Supply.
B7 OUT0P High Speed Output.
C1 IN2N High Speed Input Complement.
C2 D0 Input Address Pin (LSB).
C3 D2 Input Address Pin.
C4
RST
Reset/Disable Outputs.
C5
WE
First Bank Write Enable.
C6
CS
Chip Select Enable.
C7 OUT0N High Speed Output Complement.
D1 V
TTI
Input Termination Supply.
D2 V
EE
Negative Supply.
D3 D1 Input Address Pin.
D4 V
EE
Negative Supply.
Pin No. Mnemonic Description
D5
UPD
Second Bank Write Enable.
D6 V
CC
Positive Supply.
D7 V
TTO
Output Termination Supply.
E1 IN3P High Speed Input.
E2 A0 Address Pin (LSB).
E3 A1 Address Pin.
E4 A3 Address Pin (MSB).
E5
RE
Second Bank Read Enable.
E6 V
CC
Positive Supply.
E7 OUT1P High Speed Output.
F1 IN3N High Speed Input Complement.
F2 V
CC
Positive Supply.
F3 A2 Address Pin.
F4 V
EE
Negative Supply.
F5 V
EE
Negative Supply.
F6 V
EE
Negative Supply.
F7 OUT1N High Speed Output Complement.
G1 V
CC
Positive Supply.
G2 OUT3N High Speed Output Complement.
G3 OUT3P High Speed Output.
G4 V
TTO
Output Termination Supply.
G5 OUT2N High Speed Output Complement.
G6 OUT2P High Speed Output.
G7 V
EE
Negative Supply.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

AD8156ABCZ

Mfr. #:
Buy AD8156ABCZ
Manufacturer:
Analog Devices Inc.
Description:
Analog & Digital Crosspoint ICs 6.25 Gbps 4 x 4
Lifecycle:
New from this manufacturer.
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