LT3688
22
3688f
If WDO is low and RST goes low, then WDO will go
high. The WDE pin allows the user to turn on and off the
watchdog function. Leaving this pin open is okay and
will automatically enable the watchdog. It has an internal
weak pull-down to ground. The WDI pin has an internal
weak pull-up that keeps the WDI pin high. If watchdog is
disabled, leaving this pin open is acceptable.
Confi guration and Sequencing
Use the CONFIG pin to adjust the sequencing and the
behavior of the power-on reset and watchdog timers. The
table below shows all of the confi guration options.
Table 5. Confi guration Options
CONFIG
CONDITION HIGH LOW OPEN
Channel 1 starts before Channel 2
××
Channel 1 and Channel 2 start simultaneously
×
Watchdog operates only if Reset 1 Expires
×
Watchdog operates only if Reset 1 and Reset
2 Expire
××
RST1 and RST2 high only if Timer 1 Expires
×
RST1 and RST2 use independent timers
××
Figure 9b. CONFIG = LOW
APPLICATIONS INFORMATION
Figure 9. Startup Waveforms with the
Three Confi guration Settings
With the CONFIG pin tied high, V
OUT1
will rise fi rst, as
shown in Figure 9a. After V
OUT1
reaches V
UV
, V
OUT2
will
start increasing. In addition, the reset timer for Channel 1
starts. Once V
OUT2
reaches V
UV
, the reset timer for Channel 2
starts. Once the reset timers for both Channel 1 and Channel
2 have expired, the Watchdog will start operation.
With the CONFIG pin tied low, V
OUT1
will rise fi rst. After
V
OUT1
reaches V
UV
, V
OUT2
will start increasing. The reset
timer will only start if both V
OUT1
and V
OUT2
are above V
UV
,
as shown in Figure 9b. Once the reset timer programmed
by C
POR1
expires, both RST1 and RST2 can pull high,
and the Watchdog will start operation. In this mode, tie
C
POR2
to GND.
With the CONFIG pin open, V
OUT1
and V
OUT2
can rise
simultaneously, as shown in fi gure 9c. After V
OUT1
reaches
V
UV
the reset timer for Channel 1 starts. Once V
OUT2
reaches V
UV
, the reset timer for Channel 2 starts. Once
the reset timer for Channel 1 has expired, the Watchdog
will start operation.
Figure 9a. CONFIG = HIGH
Figure 9c. CONFIG = OPEN
V
OUT1
(10V/DIV)
V
OUT2
(10V/DIV)
RST1 (5V/DIV)
RST2 (5V/DIV)
WDO (5V/DIV)
WDI (10V/DIV)
10ms/DIV
3688 F09a
V
OUT1
(10V/DIV)
V
OUT2
(10V/DIV)
RST1 (5V/DIV)
RST2 (5V/DIV)
WDO (5V/DIV)
WDI (10V/DIV)
10ms/DIV
3688 F09b
V
OUT1
(10V/DIV)
V
OUT2
(10V/DIV)
RST1 (5V/DIV)
RST2 (5V/DIV)
WDO (5V/DIV)
WDI (10V/DIV)
10ms/DIV
3688 F09c
Selecting the Reset Timing Capacitors
The reset timeout period is adjustable in order to
accommodate a variety of microprocessor applications.
The reset timeout period, t
RST
, is adjusted by connecting
a capacitor, C
POR
, between the C
POR
pin and ground. The
value of this capacitor is determined by:
LT3688
23
3688f
C
POR
= t
RST
200
pF
ms
This equation is accurate for reset timeout periods of 1ms,
or greater. To program faster timeout periods, see the
Reset Timeout Period vs Capacitance graph in the Typical
Characteristics section. Leaving the C
POR
pin unconnected
will generate a minimum reset timeout of approximately
65s. Maximum reset timeout is limited by the largest
available low leakage capacitor. The accuracy of the
timeout period will be affected by capacitor leakage (the
nominal charging current is 2.5A), capacitor tolerance
and temperature coeffi cient. A low leakage, low tempco,
capacitor is recommended.
Selecting the Watchdog Timing Capacitor
The watchdog timeout period is adjustable and can be
optimized for software execution. The watchdog window
upper boundary, t
WDU
is adjusted by connecting a capacitor,
C
WDT
, between the C
WDT
pin and ground. Given a specifi ed
watchdog timeout period, the capacitor is determined by:
C
WDT
= t
WDU
•50
pF
ms
The window lower boundary (t
WDL
) and the watchdog
timeout (t
WDTO
) have a fi xed relationship to t
WDU
for a
given capacitor. The window lower boundary is related to
t
WDU
by the following:
t
WDL
=
1
16
•t
WDU
The watchdog timeout is related to t
WDU
by the following:
t
WDTO
=
1
8
t
WDU
Leaving the C
WDT
pin unconnected will generate a minimum
watchdog window upper boundary of approximately 200s.
Maximum window upper boundary is limited by the largest
available low leakage capacitor. The timing accuracy of the
reset and watchdog signals depends on the initial accuracy
and stability of the programing capacitors. Use capacitors
with specifi ed accuracy, leakage and voltage and temperature
coeffi cients. For surface mount ceramic capacitors C0G and
NP0 types are superior to alternatives such as X5R and X7R.
APPLICATIONS INFORMATION
5µs/DIV
V
SW
10V/DIV
I
L
500mA/DIV
3688 F12
Figure 12. The LT3688 Reduces Its Frequency to Below
70kHz to Protect Against Shorted Output with 36V Input
Shorted and Reversed Input Protection
If an inductor is chosen to prevent excessive saturation, the
LT3688 will tolerate a shorted output. When operating in
short-circuit condition, the LT3688 will reduce its frequency
until the valley current is at a typical value of 1.2A (see Figure
12). There is another situation to consider in systems where
the output will be held high when the input to the LT3688 is
absent. This may occur in battery charging applications or
in battery backup systems where a battery or some other
supply is diode ORed with the LT3688’s output. If the V
IN
pin is allowed to fl oat and the EN/UVLO pin is held high
(either by a logic signal or because it is tied to V
IN
), then
the LT3688’s internal circuitry will pull its quiescent current
through its SW pin. This is fi ne if the system can tolerate a
few mA in this state. If the EN/UVLO pin is grounded, the
SW pin current will drop to essentially zero.
However, if the V
IN
pin is grounded while the output is
held high, then parasitic diodes inside the LT3688 can
pull large currents from the output through the SW pin
and the V
IN
pin. Figure 13 shows a circuit that will run
only when the input voltage is present and that protects
against a shorted or reversed input.
PCB Layout
For proper operation and minimum EMI, care must be taken
during printed circuit board layout. Figure 14 shows the
recommended component placement with trace, ground
plane and via locations. Note that large, switched currents
ow in the LT3688’s V
IN
, DA and SW pins, the catch diode
(D1) and the input capacitor (C1). The loop formed by
LT3688
24
3688f
Figure 14. Top Layer PCB Layout in the LT3688
Demonstration Board
APPLICATIONS INFORMATION
3688 F14
these components should be as small as possible. These
components, along with the inductor and output capacitor,
should be placed on the same side of the circuit board.
Place a local, unbroken ground plane below these com-
ponents. The SW and BST nodes should be as small as
possible. Finally, keep the FB node small so that the ground
traces will shield them from the SW and BST nodes.
The exposed pad on the bottom of the package must be
soldered to ground so that the pad acts as a heat sink. To
keep thermal resistance low, extend the ground plane as
much as possible, and add thermal vias under and near
the LT3688 to additional ground planes within the circuit
board and on the bottom side.
High Temperature Considerations
The PCB must provide heat sinking to keep the LT3688
cool. The exposed pad on the bottom of the package must
be soldered to a ground plane. This ground should be tied
to large copper layers below with thermal vias; these lay-
ers will spread the heat dissipated by the LT3688. Placing
additional vias can reduce thermal resistance further. With
these steps, the thermal resistance from die (or junction)
to ambient can be reduced to θ
JA
= 40°C/W or less. With
100 LFPM airfl ow, this resistance can fall by another 25%.
Further increases in airfl ow will lead to lower thermal re-
sistance. Because of the large output current capability of
the LT3688, it is possible to dissipate enough heat to raise
the junction temperature beyond the absolute maximum
of 125°C (150°C for H Grade). When operating at high
ambient temperatures, the maximum load current should
be derated as the ambient temperature approaches 125°C
(150°C for H Grade). Power dissipation within the LT3688
can be estimated by calculating the total power loss from
an effi ciency measurement and subtracting the catch diode
loss. The die temperature is calculated by multiplying the
LT3688 power dissipation by the thermal resistance from
junction-to-ambient. Thermal resistance depends on the
layout of the circuit board, but values from 30°C/W to
60°C/W are typical. Die temperature rise was measured
on a 4-layer, 5cm • 7.5cm circuit board in still air at a load
current of 0.8A (f
SW
= 800kHz). For a 12V input to 3.3V
output the die temperature elevation above ambient was
14°C; for 12V
IN
to 5V
OUT
the rise was 15°C and for 12V
IN
to 5V
OUT
and 3.3V
OUT
the rise was 30°C.
Other Linear Technology Publications
Application Notes 19, 35 and 44 contain more detailed
descriptions and design information for buck regulators
and other switching regulators. The LT1376 data sheet
has a more extensive discussion of output ripple, loop
compensation and stability testing. Design Note 318
shows how to generate a bipolar output supply using a
buck regulator.
V
IN
3688 F13
EN/UVLO
BOOST
SW
LTC3688
BIAS
GND
DA
D4
FB
V
IN
V
OUT
+
Figure 13. Diode D4 Prevents a Shorted Input from Discharging
a Backup Battery Tied to the Output; It Also Protects the Circuit
from a Reversed Input. The LT3688 Runs Only When the Input
Is Present

LT3688IUF#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Dual 800mA Step-Down Switching Regulator with Power-On Reset and Watchdog Timer
Lifecycle:
New from this manufacturer.
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