PLT10HH101150PNL Datasheet PLT10HH450180PNL, PLT10HH9016R0PNL, PLT10HH401100PNL | P7-P9

Spec No. JEFL243B-9101F-01 P7/10

MURATA MFG.CO.,LTD

Reference Only

12.△!Caution

12.1 Mounting Direction

Mount products in right direction.

Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or

other serious trouble.

12.2 Fail Safe

Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may

be caused by the abnormal function or the failure of our products.

12.3 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)

(2) Aerospace equipment (7) Traffic signal equipment

(3)Undersea equipment (8) Disaster prevention / crime prevention equipment

(4)Power plant control equipment (9) Data-processing equipment

(5) Medical equipment (10) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

12.4 Attention regarding product's heat generation

Please pay special attention to the product’s heat generation such as beyond Operating Temperature range,

mounting product in close proximity to other products that radiate heat and beyond the rated current.

13. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

13.1 Flux and Solder

Flux Use rosin-based flux.Do not use highly acidic flux

(with chlorine content exceeding0.2(wt)%)

Do not use water soluble flux.

Solder Use Sn-3.0Ag-0.5Cu solder

Other flux (except above) please contacts us for details, then use.

13.2 Notes for Assembling

When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs.

Products can only be soldered with reflow.

The use in flow soldering is reserved.

< Thermal Shock >

Pre-heating should be in such a way that the temperature difference between solder and products

surface is limited to 150 °C max. Also cooling into solvent after soldering should be in such a way that

the temperature difference is limited to 150 °C max.

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

13.3 Attention Regarding P.C.B. Bending

The following shall be considered when designing P.C.B.'s and laying out products.

(1) P .C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

〔 Products Direction〕

Products shall be located in the sideways

direction (Length:a<b) to the mechanical stress.

(2) Products location on P.C.B. near seam for separation.

Products (A,B,C,D) shall be located carefully

so that products are not subject to the

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A > C > B ≅ D.

ＺＺ

right direction

wrong direction

〈

Poor example

〉

〈

Good example

〉

Seam

Slit

Length:a

Spec No. JEFL243B-9101F-01 P8/10

MURATA MFG.CO.,LTD

Reference Only

Pick- up nozzle

Support pin

P.C.B.

Product

13.4 Attention Regarding P.C.B. Design

< The Arrangement of Products >

P.C.B. shall be designed so that products are

far from the portion of perforation.

The portion of perforation shall be designed

as narrow as possible, and shall be designed

so as not to be applied the stress in the

case of P.C.B. separation.

Products shall not be arranged on the line

of a series of holes when there are big holes in P.C.B.

(Because the stress concentrates on the line of holes.)

< Products Placing >

Support pins shall be set under P.C.B

to prevent causing a warp to P.C.B.

during placing the products on the other

side of P.C.B.

< P.C.B. Separation >

P.C.B. shall not be separated with hand.

P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.

13.5 Standard Land Dimensions

(1) Design the land pads for this part as shown above on both side printed circuit boards

(or a multiple layered substrate ).

(2) To use PLT10HH with high current such as its rated current 6A~18A,the pattern is also should be applicable

for such high current.

The thickness of copper foil for PLT10HH should be designed as temperature rise is lower than 40 degree C

(DC resistance of land and pattern should be low according to the current).

○

P.C.B.

Portion of

Perforation

Portion of

Perforation

Product

P.C.B.

Hole

○

Spec No. JEFL243B-9101F-01 P9/10

MURATA MFG.CO.,LTD

Reference Only

13.6 Reflow Soldering

Standard soldering profile and the limit soldering profile is as follows.

The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration

of product quality.

Standard Profile Limit Profile

Pre-heating 150°C ~ 180°C , 90s ± 30s

Heating above 220°C , 30s ~ 60s above 230°C , 60s max.

Peak temperature 250°C ± 3°C 260°C , 10s

Cycle of reflo

2 times 2 times

(1)Solder paste printing for reflow soldering

· Standard thickness of solder paste should be 150 to 200 μm.

Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up the

terminal, being possible to lead to not enough connection between terminals and lands on the circuit

board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual use

condition.

· For the solder paste printing pattern, use standard land dimensions.

· For the resist and copper foil pattern, use standard land dimensions.

· Use Sn-3.0Ag-0.5Cu solder

(2) Reworking with Soldering iron

· The following conditions shall be strictly followed when using a soldering iron.

Pre-heating: 150°C, 1 min

Soldering iron: 80W max.

Tip temperature/ Soldering time: 400°C ± 5°C, within 5s

Times : 2times max.

Note: Do not touch the products directly with the tip of the soldering iron.

13.7 Cleaning Conditions

Do not clean after soldering. If cleaning, please contact us.

13.8 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

13.9 Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the Insulation

Resistance and/or corrosion of Inner Electrode may result from the use.

(1) In the corrodible atmosphere (acidic gas, alkaline gas, chlorine, sulfur gas, organic gas and etc.)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

(4) In the atmosphere where the product is covered with dust or is subjected to salty breeze.

150

90s±30s

Time(s)

250±3°C

Tem

(°C)

220°C

30～60s

180

260°C

10s

230°C

60s max.

Limit Profile

Standard Profile

P1-P3 P4-P6 P7-P9 P10-P10

PLT10HH101150PNL

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Common Mode Filters / Chokes 12.9x6.6mm 2.0uH min 15A Com Mode Coil

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PLT10HH101150PNL

PLT10HH101150PNL

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