219 Series Heat Sinks for TO-263 Devices
219-263A
www.wakefield-vette.com
Thermal Resistance
Innovation in SMT compatible heat sinks to meet the needs of newer higher power SMT semiconductors. The 219 Series heat sinks
unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of
extruded aluminum anodized heat sink body to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to
the heat sink body by forging to reduce the interface thermal resistance between the drains & heat dissipation body.
Features & Benefits:
• Increased thermal performance up to 30% over bright copper heat sinks from improved
radiation of the black finish
• Increased surface areas by 3 times therefore thermal performance up to 300% over the
aluminum stamped heat sinks on markets
• Light weight aluminum construction allows faster pick and place assembly reducing the
manufacturing cycle time
• Radius mounted “Rollers” are designed for maximizing heat transfer from component and to
avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks
• Available in bulk packaging or Tape & Reel
Tape & Reel Information
Description Attachment Length Width
Height Off
of Fin)
Temperature Rise
Forced Air Flow
Package
Type
219-263A
-
ANODZD Solderable Feet
0.500"
(12.70mm)
1.020"
(25.91mm)
0.480"
(12.19mm) 2W @ 30°C 8°C/W @ 500 LFM Bulk
