MC74HC365ADTG

MC74HC365A
http://onsemi.com
4
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol Unit
Guaranteed Limit
V
CC
V
Test ConditionsParameter
Symbol Unit
v 125_Cv 85_C
– 55 to
25_C
V
CC
V
Test ConditionsParameter
V
OL
Maximum LowLevel Output
Voltage
V
in
= V
IL
|I
out
| v 20 μA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
V
in
= V
IL
|I
out
| v 3.6 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
I
in
Maximum Input Leakage Current V
in
= V
CC
or GND 6.0 ± 0.1 ± 1.0 ± 1.0 μA
I
OZ
Maximum ThreeState
Leakage Current
Output in HighImpedance State
V
in
= V
IL
or V
IH
V
out
= V
CC
or GND
6.0 ± 0.5 ± 5.0 ± 10 μA
I
CC
Maximum Quiescent Supply
Current (per Package)
V
in
= V
CC
or GND
I
out
= 0 μA
6.0 4 40 160 μA
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input t
r
= t
f
= 6 ns)
Symbol
Parameter
V
CC
V
Guaranteed Limit
Unit
– 55 to
25_C
v 85_C v 125_C
t
PLH
,
t
PHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 3)
2.0
3.0
4.5
6.0
120
60
24
20
150
75
30
26
180
90
36
31
ns
t
PLZ
,
t
PHZ
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
2.0
3.0
4.5
6.0
220
110
44
37
275
140
55
47
330
170
66
56
ns
t
PZL
,
t
PZH
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
2.0
3.0
4.5
6.0
220
110
44
37
275
140
55
47
330
170
66
56
ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
60
22
12
10
75
28
15
13
90
34
18
15
ns
C
in
Maximum Input Capacitance 10 10 10 pF
C
out
Maximum ThreeState Output Capacitance
(Output in HighImpedance State)
15 15 15 pF
C
PD
Power Dissipation Capacitance (Per Buffer)*
Typical @ 25°C, V
CC
= 5.0 V
pF
60
* Used to determine the noload dynamic power consumption: P
D
= C
PD
V
CC
2
f + I
CC
V
CC
.
MC74HC365A
http://onsemi.com
5
SWITCHING WAVEFORMS
V
CC
GND
t
f
t
r
INPUT A
OUTPUT Y
10%
50%
90%
10%
50%
90%
t
TLH
t
PLH
t
PHL
t
THL
OUTPUT ENABLE
OUTPUT Y
OUTPUT Y
50%
50%
50%
90%
10%
t
PZL
t
PLZ
t
PZH
t
PHZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
Figure 1. Figure 2.
TEST CIRCUITS
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH
.
1 kΩ
Figure 3. Figure 4.
INPUT A
OUTPUT ENABLE 1
OUTPUT ENABLE 2
V
CC
TO OTHER
FIVE BUFFERS
Y
LOGIC DETAIL
ONE OF 6
BUFFERS
MC74HC365A
http://onsemi.com
6
PACKAGE DIMENSIONS
PDIP16
N SUFFIX
CASE 64808
ISSUE T
SOIC16
D SUFFIX
CASE 751B05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
T
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
B
A
M
0.25 (0.010) B
S
T
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
89
8X

MC74HC365ADTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers IC BUFF/DVR TRI-ST HEX
Lifecycle:
New from this manufacturer.
Delivery:
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