KSZ8852HLEYA

7 of 10
NOT
F
OR
N
EW
D
ESI
GNS
RF2046
Rev A13 DS070403
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3μinch
to 8μinch Gold over 180μinch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Mask Pattern
Figure 1. PCB Metal Land Pattern - RF204X (Top View)
A = 1.90 x 1.14 Typ.
B = 0.63 x 1.90 Typ.
Dimensions in mm.
Pin 1
BB
A
A
1.84 Typ.
3.68 Typ.
1.84 Typ.
3.68 Typ.
8 of 10
RF2046
Rev A13 DS070403
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
NOT
F
OR
N
EW
D
ESI
GNS
Reverse Isolation versus Frequency Across Temperature
I
CC
=35mA
18.0
19.0
20.0
21.0
22.0
23.0
24.0
25.0
26.0
0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0
Frequency (MHz)
Reverse Isolation (dB)
-40°C
25°C
85°C
Typical Current versus Voltage
(At Evaluation Board Connect, R
BIAS
=22 Ohms)
10.0
20.0
30.0
40.0
50.0
3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7
V
CC
(V)
I
CC
(mA)
-40°C
25°C
85°C
Typical I
CC
versus V
PIN
(At Pin 3)
10.0
20.0
30.0
40.0
50.0
3.2 3.3 3.4 3.5 3.6 3.7 3.8
V
PIN
(V)
I
CC
(mA)
-40°C
25°C
85°C
Vcc=4.2 V
Power Dissipated versus Voltage at Pin 3
(T
AMBIENT
=85°C)
0.00
0.05
0.10
0.15
0.20
2.60 2.70 2.80 2.90 3.00 3.10 3.20 3.30 3.40 3.50
V
PIN
(V)
Power Dissipated (W)
T
MAX
versus P
DISS
(T
AMBIENT
=85°C)
95.00
100.00
105.00
110.00
115.00
120.00
125.00
130.00
135.00
140.00
0.00 0.05 0.10 0.15 0.20 0.25
P
DISS
(W)
T
MAX
(°C)
MTTF versus Junction Temperature (Valid for I
CC
<35mA)
RFMD HBT2um AlGaAs-2 (60% Confidence Interval)
10.0
100.0
1000.0
10000.0
100000.0
1000000.0
10000000.0
100.0 125.0 150.0 175.0 200.0
Junction Temperature (°C)
MTTF (Years)
9 of 10
NOT
F
OR
N
EW
D
ESI
GNS
RF2046
Rev A13 DS070403
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
Figure 2. PCB Solder Mask - RF204X (Top View)
1.84 Typ.
Pin 1
BB
A
A
A = 2.06 x 1.30 Typ.
B = 0.79 x 2.06 Typ.
Dimensions in mm.
3.68 Typ.
1.84 Typ.
3.68 Typ.

KSZ8852HLEYA

Mfr. #:
Manufacturer:
Description:
Ethernet Development Tools 2-Port Ethernet Controller
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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