Copyright © 2013 Microsemi Page 5
Rev. 1.1, 01/10/2013 Analog Mixed Signal Group
One Enterprise Aliso Viejo, CA 92656 USA 1-800-713-4113, 1-949-380-6100, fax 1-949-215-4996
LX7157B
3V Input, High Frequency, 3A Step-Down Converter
Production Datasheet
Absolute Maximum Ratings
Performance is not necessarily guaranteed over this entire range. These are maximum stress ratings
only. Exceeding these ratings, even momentarily, can cause immediate damage, or negatively impact
long-term operating reliability.
Min Max Units
PVIN, VCC, EN, FB, PGOOD, VOUT, MODE to GND -0.3 7 V
SW to GND -0.3 7 V
SW to GND (Shorter than 50ns) -2 7 V
Maximum Operating Junction Temperature 150 °C
Storage Temperature Range -65 150 °C
Lead Soldering Temperature (40s, reflow) 260 (+0, -5) °C
ESD Protection at all I/O Pins (HBM, Note 1) -2 2 kV
Note 1: PVIN & SW pins are ESD sensitive.
Operating Ratings
Performance is generally guaranteed over this range as further detailed below under Electrical
Characteristics.
VCC, PVIN (Note 2) 3 5.5 V
VOUT 0.8 1.8 V
Ambient Temperature -10 85 °C
Output Current 0 3 A
Note 2: Minimum input voltage 3.5V is required in order to have 3A output current
Thermal Properties
Thermal Resistance Min Typ Max Units
θ
JA
46 °C/W
Note: The θ
JA
numbers assume no forced airflow. Junction Temperature is calculated using T
J
= T
A
+ (P
D
x θ
JA
). In particular,
θ
JA
is a function of the PCB construction. The stated number above is for a four-layer board in accordance with JESD-51
(JEDEC).
